Package structure and method of forming the same

26-12-2023 дата публикации

Номер:

US0011855057B2

Автор: Chi-Yang Yu, Yu-Min Liang, Jiun-Yi Wu, Chien-Hsun Lee

Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Контакты:

Номер заявки: 90-10-1737

Дата заявки: 08-07-2021

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/568 H01L22 H01L222 H01L2224 H01L2224/H01L2224/2 H01L2224/24 H01L2224/242 H01L2224/2422 H01L2224/24225 H01L2224/8 H01L2224/82 H01L2224/821 H01L2224/8210 H01L2224/82101 H01L2225 H01L2225/H01L2225/0 H01L2225/06 H01L2225/065 H01L2225/0652 H01L2225/06524 H01L2225/06527 H01L2225/0657 H01L2225/06572 H01L2225/0658 H01L2225/06589 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/310 H01L23/3107 H01L23/36 H01L23/367 H01L23/5 H01L23/53 H01L23/538 H01L23/5384 H01L23/5385 H01L23/5389 H01L24 H01L24/H01L24/2 H01L24/24 H01L24/8 H01L24/82 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0655 H01L25/0657 H01L25/1 H01L25/18 H01L25/5 H01L25/50

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L23 H01L23/H01L23/0 H01L23/00 H01L23/3 H01L23/31 H01L23/36 H01L23/367 H01L23/5 H01L23/53 H01L23/538 H01L23/5389 H01L25 H01L25/H01L25/0 H01L25/00 H01L25/06 H01L25/065 H01L25/0657 H01L25/1 H01L25/18 H01L25/5 H01L25/50

Цитирование НПИ

361/783

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