Semiconductor device with edge-protecting spacers over bonding pad

02-07-2024 дата публикации

Номер:

US12027479B2

Автор: Jung-Hsing Chien

Принадлежит: Nanya Technology Corp

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/768 H01L21/7682 H01L21/7683 H01L21/76831 H01L21/7688 H01L21/76885 H01L22 H01L222 H01L2221 H01L2221/H01L2221/1 H01L2221/10 H01L2221/106 H01L2221/1063 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/021 H01L2224/0217 H01L2224/0218 H01L2224/02181 H01L2224/02185 H01L2224/0219 H01L2224/022 H01L2224/0220 H01L2224/02206 H01L2224/0221 H01L2224/02215 H01L2224/03 H01L2224/030 H01L2224/0301 H01L2224/03019 H01L2224/039 H01L2224/0391 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/050 H01L2224/0500 H01L2224/05007 H01L2224/055 H01L2224/0554 H01L2224/05541 H01L2224/0556 H01L2224/0557 H01L2224/05573 H01L2224/1 H01L2224/10 H01L2224/101 H01L2224/1013 H01L2224/10135 H01L2224/13 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/485 H01L23/5 H01L23/52 H01L23/522 H01L23/5222 H01L23/5226 H01L23/53 H01L23/532 H01L23/5329 H01L23/53295 H01L24 H01L24/H01L24/0 H01L24/03 H01L24/04 H01L24/05 H01L24/1 H01L24/13 H01L29 H01L29/H01L29/4 H01L29/41 H01L29/417 H01L29/4172 H01L29/41725 H01L29/42 H01L29/423 H01L29/4236 H01L29/7 H01L29/78

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/5 H01L23/52 H01L23/522 H01L23/5226 H01L23/53 H01L23/532 H01L23/5329 H01L24 H01L24/H01L24/0 H01L24/05

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