Electronic package structure, electronic substrate and method of manufacturing electronic package structure

02-03-2023 дата публикации

Номер:

US20230061684A1

Автор: Pei-Jen LO, Shun-Tsat TU

Принадлежит: Advanced Semiconductor Engineering Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/568 H01L21/6 H01L21/68 H01L21/683 H01L21/6835 H01L22 H01L222 H01L2221 H01L2221/H01L2221/6 H01L2221/68 H01L2221/683 H01L2221/6832 H01L2221/68327 H01L2221/6834 H01L2221/68345 H01L2221/6835 H01L2221/68354 H01L2221/68359 H01L2223 H01L2223/H01L2223/5 H01L2223/54 H01L2223/544 H01L2223/5442 H01L2223/54426 H01L2223/5448 H01L2223/54486 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/021 H01L2224/0213 H01L2224/03 H01L2224/036 H01L2224/0362 H01L2224/06 H01L2224/065 H01L2224/0651 H01L2224/06515 H01L2224/08 H01L2224/082 H01L2224/0822 H01L2224/08225 H01L2224/8 H01L2224/80 H01L2224/800 H01L2224/8003 H01L2224/80031 H01L2224/8004 H01L2224/80047 H01L2224/808 H01L2224/8089 H01L2224/80895 H01L2224/80896 H01L2225 H01L2225/H01L2225/0 H01L2225/06 H01L2225/065 H01L2225/0652 H01L2225/06524 H01L2225/0654 H01L2225/06548 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/312 H01L23/3128 H01L23/5 H01L23/54 H01L23/544 H01L24 H01L24/H01L24/0 H01L24/03 H01L24/06 H01L24/08 H01L24/2 H01L24/20 H01L24/24 H01L24/8 H01L24/80 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L25/1 H01L25/16

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/68 H01L21/683 H01L21/6835 H01L23 H01L23/H01L23/5 H01L23/54 H01L23/544 H01L25 H01L25/H01L25/1 H01L25/16

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