Power semiconductor package with integrated heat spreader and partially etched conductive carrier

14-02-2017 дата публикации

Номер:

US09570379B2

Автор: Eung San Cho

Принадлежит: Infineon Technologies North America Corp

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/1 H01L2224/16 H01L2224/3 H01L2224/32 H01L2224/322 H01L2224/3224 H01L2224/32245 H01L2224/4 H01L2224/40 H01L2224/402 H01L2224/4024 H01L2224/40245 H01L2224/41 H01L2224/410 H01L2224/4103 H01L2224/8 H01L2224/83 H01L2224/838 H01L2224/8380 H01L2224/83801 H01L2224/8384 H01L2224/8385 H01L2224/84 H01L2224/848 H01L2224/8480 H01L2224/84801 H01L2224/8484 H01L2224/8485 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/495 H01L23/4952 H01L23/49524 H01L23/4956 H01L23/49562 H01L23/49568 H01L24 H01L24/H01L24/3 H01L24/36 H01L24/4 H01L24/40 H01L24/41 H01L29 H01L29/H01L29/2 H01L29/20 H01L29/200 H01L29/2003 H01L29/7 H01L29/77 H01L29/778 H01L29/7788 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0002 H01L2924/1 H01L2924/13 H01L2924/130 H01L2924/1305 H01L2924/13055 H01L2924/1309 H01L2924/13091 H01L2924/18 H01L2924/181

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/495 H01L23/4957 H01L23/49575 H01L29 H01L29/H01L29/2 H01L29/20 H01L29/200 H01L29/2003 H01L29/207

Получить PDF