Semiconductor component with metallized sidewalls on silicon wafer power components has a metal edging surrounding the components on an underside and on partially covered metal sidewalls and deep troughs etched on silicon wafers.

03-05-2001 дата публикации

Номер:

DE19951945A1

Автор: Markus Thoben, Wolfgang Staiger

Принадлежит: DaimlerChrysler AG

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0402 H01L2224/04026 H01L2224/2 H01L2224/26 H01L2224/261 H01L2224/2614 H01L2224/26145 H01L2224/27 H01L2224/270 H01L2224/2701 H01L2224/27013 H01L2224/3 H01L2224/32 H01L2224/320 H01L2224/3205 H01L2224/32057 H01L2224/32058 H01L2224/322 H01L2224/3224 H01L2224/32245 H01L2224/4 H01L2224/48 H01L2224/484 H01L2224/4849 H01L2224/48491 H01L2224/8 H01L2224/83 H01L2224/830 H01L2224/8305 H01L2224/83051 H01L2224/831 H01L2224/8319 H01L2224/833 H01L2224/8336 H01L2224/83365 H01L2224/838 H01L2224/8380 H01L2224/83801 H01L23 H01L23/H01L23/4 H01L23/47 H01L23/473 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/3 H01L24/32 H01L24/4 H01L24/48 H01L24/8 H01L24/83 H01L29 H01L29/H01L29/0 H01L29/06 H01L29/065 H01L29/0657 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/01 H01L2924/010 H01L2924/0100 H01L2924/01005 H01L2924/0101 H01L2924/01014 H01L2924/0102 H01L2924/01029 H01L2924/0106 H01L2924/01068 H01L2924/014 H01L2924/1 H01L2924/10 H01L2924/101 H01L2924/1015 H01L2924/10156 H01L2924/10158 H01L2924/102 H01L2924/1025 H01L2924/10253 H01L2924/19 H01L2924/190 H01L2924/1904 H01L2924/19043

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/47 H01L23/473 H01L24 H01L24/H01L24/4 H01L24/48 H01L24/8 H01L24/83