Semiconductor device and method of forming embedded conductive layer for power/ground planes in fo-ewlb

01-12-2017 дата публикации

Номер:

TWI607515B

Автор: 林耀劍, 包旭升, 陳康, LIN YAOJIAN, BAO XU SHENG, CHEN KANG, LIN, YAOJIAN, BAO, XU SHENG, CHEN, KANG

Принадлежит: 史達晶片有限公司, STATS CHIPPAC LTD, STATS CHIPPAC, LTD.

Контакты:

Номер заявки: 56-07-10316

Дата заявки: 06-03-2014

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/4 H01L21/48 H01L21/485 H01L21/5 H01L21/56 H01L21/568 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/041 H01L2224/0410 H01L2224/04105 H01L2224/1 H01L2224/12 H01L2224/121 H01L2224/1210 H01L2224/12105 H01L2224/2 H01L2224/24 H01L2224/241 H01L2224/2419 H01L2224/24195 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/498 H01L23/4981 H01L23/49816 H01L23/4982 H01L23/49822 H01L23/49827 H01L23/4983 H01L23/49833 H01L23/5 H01L23/53 H01L23/538 H01L23/5389 H01L24 H01L24/H01L24/1 H01L24/19 H01L24/9 H01L24/97 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/01 H01L2924/013 H01L2924/0132 H01L2924/01322 H01L2924/1 H01L2924/12 H01L2924/120 H01L2924/1204 H01L2924/12041 H01L2924/12042 H01L2924/13 H01L2924/130 H01L2924/1306 H01L2924/1309 H01L2924/13091 H01L2924/18 H01L2924/181 H01L2924/1816 H01L2924/18162 H01L2924/3 H01L2924/35 H01L2924/351 H01L2924/3511

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/60 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/488

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