Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield

23-08-2016 дата публикации

Номер:

US09425143B2

Автор: Kyu-Pyung Hwang, Young Kyu Song

Принадлежит: Qualcomm Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01F H01F1 H01F17 H01F17/H01F17/0 H01F17/00 H01F17/000 H01F17/0006 H01F2 H01F20 H01F201 H01F2017 H01F2017/H01F2017/0 H01F2017/00 H01F2017/002 H01F2017/008 H01F27 H01F27/H01F27/2 H01F27/28 H01F27/280 H01F27/2804 H01F27/29 H01F27/292 H01F27/3 H01F27/36 H01F27/363 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/568 H01L21/6 H01L21/68 H01L21/683 H01L21/6835 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/023 H01L2224/0231 H01L2224/0237 H01L2224/04 H01L2224/041 H01L2224/0410 H01L2224/04105 H01L2224/1 H01L2224/12 H01L2224/121 H01L2224/1210 H01L2224/12105 H01L2224/2 H01L2224/24 H01L2224/241 H01L2224/2419 H01L2224/24195 H01L23 H01L23/H01L23/2 H01L23/28 H01L23/3 H01L23/31 H01L23/310 H01L23/3107 H01L23/5 H01L23/50 H01L23/52 H01L23/522 H01L23/5226 H01L23/5227 H01L23/55 H01L23/552 H01L23/6 H01L23/64 H01L23/645 H01L24 H01L24/H01L24/1 H01L24/13 H01L24/18 H01L24/19 H01L24/2 H01L24/20 H01L24/9 H01L24/96 H01L25 H01L25/H01L25/1 H01L25/16 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/14 H01L2924/142 H01L2924/1421 H01L2924/19 H01L2924/190 H01L2924/1901 H01L2924/19011 H01L2924/1904 H01L2924/19042 H01L2924/191 H01L2924/1910 H01L2924/19105 H01L2924/3 H01L2924/30 H01L2924/302 H01L2924/3025

IPC - классификация

H H0 H01 H01F H01F1 H01F17 H01F17/H01F17/0 H01F17/00 H01F17/001 H01F17/0013 H01F2 H01F27 H01F27/H01F27/2 H01F27/29 H01F27/292 H01F27/3 H01F27/36

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