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Semiconductor device package and methods of formation

Номер патента: US20240038649A1
Опубликовано: 01-02-2024
Автор(ы): Jun He, Li-Hsien HUANG, Tien-Chung Yang, Ting-Ting KUO, Yao-Chun Chuang, Yinlung Lu
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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