Adhesive film, manufacturing method of semiconductor device, and semiconductor device

06-04-2020 дата публикации

Номер:

KR102097346B1

Автор: 겐지 오니시, 사다히토 미스미, 유이치로 시시도

Принадлежит: 닛토덴코 가부시키가이샤

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

C C0 C09 C09J C09J2 C09J22 C09J220 C09J2203 C09J2203/C09J2203/3 C09J2203/32 C09J2203/326 C09J23 C09J230 C09J2301 C09J2301/C09J2301/3 C09J2301/30 C09J2301/304 C09J2301/31 C09J2301/312 C09J7 C09J7/C09J7/2 C09J7/22 C09J7/3 C09J7/30 C09J7/35 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/0 H01L21/02 H01L21/020 H01L21/0201 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/05 H01L2224/055 H01L2224/0559 H01L2224/05599 H01L2224/1 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L2224/16227 H01L2224/4 H01L2224/45 H01L2224/450 H01L2224/4501 H01L2224/45015 H01L2224/451 H01L2224/4512 H01L2224/45124 H01L2224/4514 H01L2224/45144 H01L2224/45147 H01L2224/48 H01L2224/480 H01L2224/4809 H01L2224/48091 H01L2224/482 H01L2224/4822 H01L2224/48227 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7320 H01L2224/73204 H01L2224/7326 H01L2224/73265 H01L2224/8 H01L2224/81 H01L2224/811 H01L2224/8119 H01L2224/81191 H01L2224/814 H01L2224/818 H01L2224/8181 H01L2224/81815 H01L2224/85 H01L2224/852 H01L2224/8520 H01L2224/85205 H01L2224/853 H01L2224/8539 H01L2224/85399 H01L2224/9 H01L2224/92 H01L2224/922 H01L2224/9224 H01L2224/92247 H01L2225 H01L2225/H01L2225/0 H01L2225/06 H01L2225/065 H01L2225/0650 H01L2225/06506 H01L2225/0651 H01L2225/06517 H01L2225/0657 H01L2225/06575 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/312 H01L23/3121 H01L24 H01L24/H01L24/1 H01L24/16 H01L24/4 H01L24/42 H01L24/45 H01L24/48 H01L24/8 H01L24/85 H01L25 H01L25/H01L25/0 H01L25/03 H01L25/5 H01L25/50 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/15 H01L2924/157 H01L2924/1574 H01L2924/15747 H01L2924/1578 H01L2924/15788 H01L2924/18 H01L2924/181

IPC - классификация

H H0 H01 H01L H01L2 H01L24 H01L24/H01L24/4 H01L24/48 H01L24/7 H01L24/78 H01L25 H01L25/H01L25/0 H01L25/03

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