Semiconductor package and method for manufacturing the same

16-08-2005 дата публикации

Номер:

TW0200527557A

Автор: Yao-Ting Huang, HUANG YAO-TING, HUANG, YAO-TING

Принадлежит: Advanced Semiconductor Eng

Контакты:

Номер заявки: 46-28-9310

Дата заявки: 06-02-2004

A semiconductor package includes a semiconductor chip, a first substrate layer and a second substrate layer. The semiconductor chip has an active surface and a plurality of pads disposed on the active surface. The first substrate layer is formed on the active surface of the semiconductor chip and has a plurality of first contacts electrically connected to the pads of the semiconductor chip. The second substrate layer is substantially smaller than the first substrate layer, is formed on the first substrate layer, and has a plurality of second contacts electrically connected to the first contacts of the first substrate layer.

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/1 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16227 H01L2224/3 H01L2224/32 H01L2224/321 H01L2224/3214 H01L2224/32145 H01L2224/322 H01L2224/3222 H01L2224/32225 H01L2224/4 H01L2224/48 H01L2224/480 H01L2224/4809 H01L2224/48091 H01L2224/482 H01L2224/4822 H01L2224/48227 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7320 H01L2224/73204 H01L2224/7326 H01L2224/73265 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/311 H01L23/3114 H01L23/4 H01L23/49 H01L23/498 H01L23/4983 H01L23/49833 H01L23/5 H01L23/53 H01L23/538 H01L23/5385 H01L24 H01L24/H01L24/4 H01L24/48 H01L25 H01L25/H01L25/1 H01L25/16 H01L25/5 H01L25/50 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/1 H01L2924/12 H01L2924/120 H01L2924/1204 H01L2924/12042 H01L2924/14 H01L2924/18 H01L2924/181 H01L2924/19 H01L2924/191 H01L2924/1910 H01L2924/19105

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/4 H01L23/49 H01L23/495 H01L23/498 H01L23/5 H01L23/53 H01L23/538

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