Bonding apparatus, bonding system, bonding method and storage medium

20-04-2021 дата публикации

Номер:

US10985132B2

Автор: Kenji SUGAKAWA, Takashi NAKAMITSU, Yoshitaka Otsuka, yosuke Omori

Принадлежит: Tokyo Electron Ltd

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

B B3 B32 B32B B32B1 B32B15 B32B15/B32B15/0 B32B15/01 B32B2 B32B20 B32B204 B32B2041 B32B2041/B32B2041/0 B32B2041/04 B32B24 B32B245 B32B2457 B32B2457/B32B2457/1 B32B2457/14 B32B3 B32B37 B32B37/B32B37/0 B32B37/00 B32B37/004 B32B37/0046 B32B37/1 B32B37/10 B32B4 B32B41 B32B41/B32B41/0 B32B41/00 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/1 H01L21/18 H01L21/187 H01L21/2 H01L21/20 H01L21/200 H01L21/2007 H01L21/6 H01L21/67 H01L21/670 H01L21/6709 H01L21/67092 H01L21/671 H01L21/6712 H01L21/67121 H01L21/672 H01L21/6720 H01L21/67207 H01L21/6724 H01L21/67242 H01L21/6725 H01L21/67253 H01L21/67259 H01L21/677 H01L21/6773 H01L21/67739 H01L21/6774 H01L21/67742 H01L21/68 H01L21/683 H01L21/6838 H01L22 H01L222 H01L2224 H01L2224/H01L2224/7 H01L2224/75 H01L2224/751 H01L2224/7515 H01L2224/753 H01L2224/7530 H01L2224/75302 H01L2224/75305 H01L2224/7531 H01L2224/755 H01L2224/7555 H01L2224/756 H01L2224/7565 H01L2224/757 H01L2224/7574 H01L2224/75744 H01L2224/75745 H01L2224/759 H01L2224/7590 H01L2224/75901 H01L2224/7598 H01L2224/75981 H01L2224/75986 H01L2224/8 H01L2224/80 H01L2224/800 H01L2224/8000 H01L2224/80009 H01L2224/8001 H01L2224/80013 H01L2224/802 H01L2224/8020 H01L2224/80201 H01L2224/808 H01L2224/8089 H01L2224/80894 H01L2224/809 H01L2224/8090 H01L2224/80908 H01L2224/83 H01L2224/830 H01L2224/8300 H01L2224/83009 H01L2224/832 H01L2224/8320 H01L2224/83201 H01L2224/838 H01L2224/8389 H01L2224/83894 H01L2224/839 H01L2224/8390 H01L2224/83908 H01L24 H01L24/H01L24/7 H01L24/75 H01L24/8 H01L24/80 H01L24/83

IPC - классификация

B B3 B32 B32B B32B1 B32B15 B32B15/B32B15/0 B32B15/01 B32B4 B32B41 B32B41/B32B41/0 B32B41/00 H H0 H01 H01L H01L2 H01L24 H01L24/H01L24/8 H01L24/83

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