BUNDLE OF LONG THIN CARBON STRUCTURES, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

In the bundle of long thin carbon structures of the present invention, end parts of the bundle are interconnected in a carbon network. The interconnected end parts form a flat surface. By this, an electrical connection structure with low resistance and/or a thermal connection structure with high thermal conductivity are obtained. The bundle of long thin carbon structures can be used suitably as a via, heat removal bump or other electronic element.