Chip package and chip packaging method

04-07-2019 дата публикации

Номер:

US20190202685A1

Автор: Zhiqi Wang

Принадлежит: China Wafer Level CSP Co Ltd

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

B B8 B81 B81B B81B2 B81B22 B81B220 B81B2203 B81B2203/B81B2203/0 B81B2203/03 B81B2203/031 B81B2203/0315 B81B2203/035 B81B2203/0353 B81B2207 B81B2207/B81B2207/0 B81B2207/01 B81B2207/012 B81B2207/09 B81B2207/1 B81B2207/11 B81B2207/115 B81B7 B81B7/B81B7/0 B81B7/00 B81B7/007 B81B7/0077 B81B7/02 B81C B81C1 B81C1/B81C1/0 B81C1/00 B81C1/002 B81C1/0023 B81C1/00238 B81C1/003 B81C1/0033 B81C1/00333 H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/023 H01L2224/0237 H01L2224/02371 H01L2224/05 H01L2224/055 H01L2224/0554 H01L2224/05548 H01L2224/1 H01L2224/13 H01L2224/130 H01L2224/1302 H01L2224/13023 H01L2224/131 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16227 H01L2224/9 H01L2224/94 H01L2224/97 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/09 H01L24/1 H01L24/13 H01L24/16 H01L24/17 H01L24/7 H01L24/73 H01L24/9 H01L24/94 H01L24/97 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/14 H01L2924/143 H01L2924/1433 H01L2924/146 H01L2924/1461 H01L2924/15 H01L2924/151 H01L2924/1515 H01L2924/15151 H01L2924/1519 H01L2924/15192 H01L2924/153 H01L2924/1531 H01L2924/15311 H01L2924/3 H01L2924/35 H01L2924/351

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/482 H01L23/4824 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/9 H01L24/97

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