Adhesive composition, circuit connection material, circuit member connection structure and semiconductor device
The present invention is application number 200680038502.7 (International application number PCT/JP2006/316589), date of application to 24 August 2006, title of invention for "adhesive composition, circuit connection material, circuit member connection structure and semiconductor device" applied for of the application of the invention. Technical Field The invention relates to adhesive composition, circuit-connecting material, the connection of the circuit components and semiconductor device structure. Background Art The semiconductor elements and liquid crystal display element, in order to combine the various components in the component, has been the use of various bonding adhesive, the requirements for the characteristics of the adhesive, as by adhesion, also broadly relates to heat resistance, high-temperature and high-humidity state in the reliability and the like. In the prior art, as the semiconductor component and liquid crystal display element the use of adhesive, excellent adhesion property to use, in particular even under the high-temperature condition has shown excellent cementability hot hardness of such as epoxy resin and the like of the resin (for example, refer to Patent document 1). The above-mentioned adhesive composition of general use the epoxy resin, having reactivity with epoxy resin hardener such as a phenolic resin, epoxy resin with a hardener of the reaction promoting catalyst latent heat. Catalyst latent heat hardening temperature of the bond is determined by the speed of the and hardening an important factor, the storage stability at room temperature and heating time of the hardening rate point of view, the use of various to compound. The adhesive, in general through 170-250 the heating temperature of [...] 1-3 hours without hardening, thereby obtaining cementability. In recent years, with the gao Jiti melts of the semiconductor element, liquid crystal element of high-precision, inter-element and wiring between smallly development towards the insulation. The case of the semiconductor element using the above-mentioned adhesive, its hardening because the heating temperature is high and the slow speed for hardening, not only the connecting part is the desired, is the excessive heating of the surrounding material, the surrounding material will have become the main cause of the tendency of damage. Furthermore, in order to low cost, the need to improve production yield, requested low-temperature (the 100-170 [...]), short time (1 hours), in other words, "low-temperature fast hardening" for bonding. In order to realize this low-temperature fast hardening, it is necessary to use the active energy catalyst latent heat , however, activity latent heat catalyst can be low, it is very difficult to at the same time in the vicinity of the a storage stability at room temperature. Recently, the acrylic acid ester derivative or methyl acrylic acid ester derivative (later referred to as (meth) acrylic acid ester) and as a free radical polymerization initiator of the free radical peroxide phase and for hardening adhesive contemplated, free radical hardening, because the free radicals as reaction active species rich in reactivity, so that the hardening a short period of time (for example, refer to Patent literature 2, 3). Patent literature 1: extra Kaiping 01-113480, the Patent literature 2 : opens especially 2002-203427, the Patent literature 3: International discloses section 98/044067 of booklet Content of the invention However, because free radical hardening type adhesive having a high reactivity, the hardening treatment is the process of the time-domain (process margin) the tendency of narrowed, for example, in order for the semiconductor element and is electrically connected with the liquid crystal display element using the above-mentioned free radical curing of the adhesive, the hard compound by the temperature and the time, and as long as the process conditions change slightly, will be unable to obtain a stable bonding strength, resistance, and the like is the tendency of the characteristic. Therefore, in view of the above problems, the purpose of this invention is to provide in a low-temperature can be sufficiently quick hardening treatment, and hardening treatment process of the time-domain is wide, the characteristic of having a sufficiently stable (is connected with the resistance and bonding strength) of the adhesive composition, and using the same material of the circuit connection of the, circuit member connection structure and semiconductor device. The present invention provides a thermoplastic resin containing a, free radical polymerizable compounds and free radical polymerization initiator in the adhesive component of the adhesive composition, the above-mentioned adhesive component is 25 the ESR [...] carried out with a signal in the measurement of the adhesive composition. The adhesive composition, can be fully in the low temperature rapid hardening treatment, and hardening treatment process of the time-domain is wide, can be fully stable bonding strength of the characteristic of the and is connected with the resistors, and the like. Although the adhesives of the present invention realizes the above-mentioned composition of the main reasons for the related effect, up to now was still not clear, but the present inventors, that the main reason for this is as follows, but the main reason for not limited to this. In other words, at low temperature, the hardening can be the main reason for a short period of time, mainly due to adhesive composition of this invention containing the thermoplastic resin, free radical polymerizable compounds and the free-radical polymerization initiator of the adhesive components, i.e., because it is of the so-called free radical curing adhesive composition. The process of conducting a curing treatment of the time-domain is wide, can be fully stable of the main reasons why the characteristics of the, mainly because the adhesive composition of this invention containing the 25 the ESR [...] carried out with a signal in the measurement of the adhesive component. In other words, components of adhesives of the present invention stably there is radical. The present inventors, such as integral indivisible speculative because the above-mentioned form, the hardened low-temperature short time can be realized, at the same time the process of conducting a curing treatment of the time-domain is wide, stable characteristic fully promoted to the high level. As mentioned above, the adhesive composition of the present invention, the conducting a curing treatment in a short time, and the time domain the process can be extended. Therefore, adhesive composition of this invention is that even if the semiconductor elements and liquid crystal element or the like and wiring between elements between smallly insulation, not only the connection part of the desired, even when the surrounding material to be heated, can still inhibit such as the periphery of the impact of damage of the component, can be improved. Furthermore, adhesive composition of the present invention, the adhesive component in measurement of ESR value, preferably g is 2.0000-2.0100, because with the g value, the resulting adhesive composition can be expanded in the time domain the process of hardening treatment. Adhesive composition of the present invention, preferably the above-mentioned adhesive component longer contains the stable free radical compound, the "stable free radical compound" is measured by means of measuring ESR in the under-balanced state for the spin density 1016 spin/g the state of the above, in the 25 the sustained [...] 10 minutes the compounds of above. By this, in the adhesive composition, because free radical is more stable to exist, can be expanded in the time domain the process of hardening treatment. And, the above compound is preferably a stable free radical compound (nitroxide) nitrided oxygen , contain such a compound, the adhesive composition can be expanded in the time domain the process of hardening treatment. Adhesive composition of the present invention, relative to 100 parts by mass of a thermoplastic resin, preferably contains 50-250 parts by mass of the radical polymerizable compound, 0.05-30 parts by mass of the radical polymerization initiator and 0.01-10 parts by mass of a stable free radical compound. Adhesive composition of the present invention, by making the its constituent material according to the above-mentioned range of the mixing ratio of, play can be significantly more effect of the present invention. Adhesive composition of the present invention, preferably also containing conductive particles, the adhesive composition can be easily with autologuous conductive, therefore, the adhesive composition, and the circuit electrodes of semiconductor, electronic and electrical industry in the field of industry, can be used as a conductive adhesive to use; and, in this situation, because the adhesive composition has conductivity, so can more reduce the connection resistance after hardening. Furthermore, adhesive composition of the present invention, relative to 100 parts by mass of a thermoplastic resin, preferably contains 0.5-30 parts by mass of the conductive particles. The mixing proportion of the conductive particles is set in the above-mentioned range, the adhesive composition can be produced by more play the effect of conductive particles. For example, the connection of the electrode used in the circuit, can possess anisotropic conductive, prevent the opposite direction of the inter-electrode circuit is not conductive or prevent the short circuit between the electrodes of adjacent circuit. Moreover, according to the above-mentioned mixing proportion of the adhesive composition containing conductive particles, electrical connection can be more display the anisotropic, can be used as the anisotropic conductive adhesive composition to use. The circuit of this invention is used for making the connection material to the circuit electrode is electrically connected between the circuit-connecting material, the connecting material preferably contains the above-mentioned adhesive composition. Such a circuit is connected with the material, even if low temperature can also be carried out within a short period of time sufficient for the bonding to the circuit between the electrodes, the time domain the process can also be enlarged. Moreover, such a circuit is connected with the material by the process of, the hard compound obtained even if the change of the process temperature and time, can also make the bonding strength is stable. Furthermore, also can inhibit circuit is connected with the process of the material of the bonding strength with the elapse of time is reduced, and, if the circuit-connecting material according to the above-mentioned mixing ratio containing conductive particles, electrical connection can be more display the anisotropic, for electrode can be used as a circuit an anisotropic conductive circuit connection material to use. The present invention provides the above-mentioned adhesive composition of the film formed by the film-like adhesive, in addition, the present invention provides the above-mentioned circuit is connected with the material to form a thin film-like circuit formed by the connecting material. Forming a thin-film-like adhesive composition and circuit connection material because of excellent operability, can be more improved. The present invention provides a circuit member connection structure, it possesses: 1st is formed on the main surface of the circuit substrate a 1st 1st circuit components of the circuit electrodes, 2nd is formed on the main surface of the circuit substrate with the circuit electrodes 2nd 2nd circuit member, is disposed in the 1st circuit substrate with the principal plane of the main surface of the circuit board between the 2nd and the 1st and 2nd circuit electrodes on the circuit electrodes to the configuration state of the circuit connection of the member is electrically connected with; circuit is connected with the component is the above-mentioned circuit is connected with the process of the material. Such a circuit member connection structure, is capable of effectively utilizing the already electrically connected with the circuit electrode, in other words, because of the circuit connection of the material using the above-mentioned 1st 2nd order with the circuit electrodes may be electrically connected to circuit electrodes, the connection structure of this invention with little deviation of the quality of circuit components, can display the full a stable characteristic. Moreover, circuit connecting material containing conductive particles in the process, the connecting resistance can be reduced by mixing the conductive particles, can be easily realized between the desired selectivity of the component of the electrical connection. Furthermore, according to the above-mentioned mixing ratio if containing conductive particles, electrically connected to display the anisotropic, can also become anisotropic conductive circuit connection material. Furthermore, the present invention provides a semiconductor device, it is provided with: a semiconductor element, the semiconductor element disposed on the substrate and semiconductor element and the base plate and between the semiconductor element and the base plate is electrically connected to the semiconductor element is connected with the component; the semiconductor element is connected with the component of the above-mentioned adhesive composition is cured or film adhesive. Such a semiconductor device, since the semiconductor element is electrically connected with the substrate of the adhesive composition for the above-mentioned poly process of the adhesive composition, the less variations in the quality, can display the full a stable characteristic. Moreover, an adhesive composition containing conductive particles in the process, the connecting resistance can be reduced, by mixing the conductive particles, can sufficiently ensure the between the semiconductor element and the base plate the conductivity. According to the invention, can be offered in the low temperature can be very fast hardening treatment, the process of conducting a curing treatment of the time-domain is wide, the characteristic of having a sufficiently stable (is connected with the resistance and bonding strength) of the adhesive composition, and using the same material of the circuit connection of the, circuit member connection structure and semiconductor device. Description of drawings Figure 1 of the present invention that the connection of the circuit components of the structure of one embodiment of a partial cross-sectional view. Figure 2 is a series of steps on component of the circuit diagram. Fig. 3 of the semiconductor device of this invention that the one of the embodiment of a partial cross-sectional view. Symbol description 1: circuit member connection structure, 2: semiconductor device, 5: adhesive component, 7: conductive particles, 10: circuit is connected with the member, 11: insulating material, 20 : 1st circuit member, 21 : 1st circuit substrate, 22 : 1st circuit electrode, 30 : 2nd circuit member, 31 : 2nd circuit substrate, 32 : 2nd circuit electrode, 40: film-like circuit connecting member, 50: semiconductor element, 60: base plate, 61: circuit pattern, 70: closed material, 80: semiconductor element is connected with the component. Mode of execution The following, with reference to the necessary, on detailed description of the optimum embodiment of the present invention, moreover, in the attached drawing, the same elements with the same symbol, repeated description is omitted. Furthermore, the positional relationship of the upper and lower left and right sides, and the like, so long as there is no special requirement, based on the position of the with the relations on. Moreover, the size of the is not arrests is restricted in with the ratio of the proportion shown. Furthermore, in the specification "(meth) acrylate" means "acrylate" and its corresponding "methyl acrylate"; "(meth) acrylic" means "acrylic" and its corresponding "methacrylic acid"; "(meth) acryl" means "acryl" and its corresponding "methacryloxyl acyl". Adhesive composition Adhesive composition of the present invention, having a thermoplastic resin, free radical polymerizable compound, the radical polymerization initiator in the adhesive composition, the above-mentioned adhesive component in 25 the ESR [...] in the measurement carried out with a signal. Here, the thermoplastic resin correlated to this invention, is used for the adhesion object (the following only referred to as "is placed") are firmly bonded with each other. The method of the invention uses the thermoplastic resin, and no special limitation, known resin can be used, in particular, can be used such as polyamide, phenoxy resin, poly (meth) acrylic acid esters, polyimides, polyurethanes, polyester, polyethylene d acetal, and the like, can be used singly or mixed 2 the above. Moreover, these resins can also be in the molecule containing siloxane key or fluorine substituent. These resin can be totally insoluble in the mixed resin between, or as long as a micro-phase separation is to generate state nebulousurine can also be suitable. Furthermore, the molecular weight of the above-mentioned thermoplastic resin does not have special limitation, the greater the molecular weight of the thermoplastic resin can be more easy to form the latter thin-film, as the bond can be will affect the flow properties of the melt viscosity of the set in a broad range. If the melt viscosity is set in a broad range, for the semiconductor element and the adhesion of the liquid crystal element or the like, even if the inter-element and wiring between smallly insulation, can further prevent the adhesive attached to the peripheral component, can be improved. General weight average molecular weight is preferably 5000-150000, especially preferably 10000-80000. Weight average molecular weight less than 5000, the latter is used as the thin film to use, will be the tendency of the thin-film forming property is insufficient, a weight average molecular weight of more than 150000, will be with the other ingredients of the tendency of poor compatibility. Furthermore, in this specification a weight average molecular weight, is prepared in compliance with the following conditions by the gel permeation chromatography (GPC) analysis, used for measuring the following conditions, using standard polystyrene calibration curve of the calculated by the conversion. GPC conditions Using machine: Hitachi L-6000-type ((strain) Hitachi manufacturing the systems, tradenames) Detector: L-3300RI ((strain) Hitachi manufacturing the systems, tradenames) Column: GL-R440 GL-R430 +gelpack GL-R420 +gelpack gelpack (total 3 supporting) (Hitachi chemical industrial (strain) systems, tradenames) liquate fluid : tetrahydrofuran Measuring temperature: the 40 [...] Flow: 1.75 ml/min The method of the invention uses the free radical polymerizable compound, by giving is because with a certain kind of energy and producing free radicals, by the free-radical chain reaction of polymerization to form the polymer compound, the radical polymerization reaction in general than the cationic polymerization or anionic polymerization reaction is carried out more rapidly, therefore, the use of a free radical polymerizable compound of the invention, can be in a relatively short time for polymerization. The method of the invention uses the free radical polymerizable compound, as long as (meth) acrylic acid, (meth) acryloyl groups in the molecule or vinyl and the like having a carbon-carbon double bond is a compound of, and there is no particular limitation, known compounds can be used, in order to have the (meth) acryloyl group in a radical-polymerizable compound is preferred. Specific examples of free-radical polymerizable compound, can be enumerated such as epoxy (meth) acrylate oligomer, amino acetic acid (meth) acrylate oligomer, polyether (meth) acrylate oligomer, polyester (meth) acrylate oligomer, the oligomer, propane three trimethylolpropane (meth) acrylate, polyethylene glycol di (meth) acrylate, polyoxyalkylated glycol (meth) acrylate, bicyclic pentenyl (meth) acrylate, b cyclopentene propoxycyclohexyl ethyl (meth) acrylate, new pentamethylene glycol two (meth) acrylate, dipentaerythritol (meth) acrylate, three poly isocyanic acid modified 2 functional (meth) acrylic ester, three poly isocyanic acid modified 3 functional (meth) acrylate, 2, 2 the [...] -di (meth) acryloxy-diethyl phosphorus acid ester, 2-(meth) acryloxy-ethyl acid phosphate ester, a polyfunctional (meth) acrylic acid ester compound, the necessary mixing may be used alone or 2 or more use. Free radical polymerizable compound of the present invention, as long as it has (meth) acryloyl group as a crosslinker, does not need to choose the material of the adhesive, can be firmly bonded. As the adhesive, can be enumerated a printed circuit board and the organic substrate is polyimide, such as the first, containing copper and, the occurrence of metal and ITO (indium tin oxide, indium tin oxide), silicon nitride (SiN), silicon dioxide (SiO2) the material of the base material, and the like. Adhesive composition of this invention in the mixing ratio of the free radical polymerizable compound, relative to 100 parts by mass of a thermoplastic resin, preferably 50-250 parts by mass, more preferably 60-150 parts by mass. If the radical-polymerizable compound does not reach the mixing ratio of 50 parts by weight, of the adhesive composition will be a reduced tendency of the heat resistance of the poly, if more than 250 parts by mass, the following is used as the adhesive composition of the thin film, a thin film will be the tendency of insufficient formability. Furthermore, adhesive composition of this invention containing free radical polymerization initiator. Free radical polymerizable compound, once begin to free-radical polymerization reaction, a chain reaction is carried out, can be firmly hardened, but initially more difficult to produce free radical. Therefore, this invention is to make the adhesive composition contains can be more easily free radical generating free radical polymerization initiator. The invention-related free radical polymerization initiator, from the prior art, can be used not only known superoxyde and partner nitride compounds of known compounds and the like. Specifically, can be enumerated such as cumenyl peroxidises new last of the ten Heavenly Stems ester, 1, 1, 3, 3-tetramethyl-butyl peroxidises new last of the ten Heavenly Stems ester, 1-cyclohexyl-1-methyl ethyl peroxidises new last of the ten Heavenly Stems ester, t-hexyl peroxidises new last of the ten Heavenly Stems ester, t-butyl peroxidises new last of the ten Heavenly Stems ester, t-butyl peroxidises trimethyl acetate, 1, 1, 3, 3-tetramethyl-butyl peroxide-2- ethyl caproate , 2, 5-dimethyl -2, 5-bis (2-ethyl-based oneself acyl group peroxidises) hexane, t-hexyl peroxidises-2- ethyl caproate , t-butyl peroxidises-2- ethyl caproate , t-butyl peroxidises new age ester, t-pentylimidazolium peroxidises-2- ethyl caproate , b-t-butyl peroxidises hexahydro phthalic acid ester, t-pentylimidazolium peroxidises -3, 5, 5-trimethyl base oneself ester, 3-hydroxy -1, 1-dimethyl-butyl peroxidises new last of the ten Heavenly Stems ester, 1, 1, 3, 3-tetramethyl-butyl peroxide-2- ethyl caproate , t-pentylimidazolium peroxidises new last of the ten Heavenly Stems ester, t-pentylimidazolium peroxidises-2- ethyl caproate , 2, 2 the [...] -azo dihydrogenmethylenebisphosphonate -2, 4-dimethyl valeronitriles, 1, the 1 [...] -azo dihydrogenmethylenebisphosphonate (1-acetoxy-1-phenyl-ethane), 2, 2 the-azo dihydrogenmethylenebisphosphonate isobutanenitrile [...] , 2, 2 the [...] -azo dihydrogenmethylenebisphosphonate (2-methyl butyronitrile), dimethyl -2, 2 the-azo dihydrogenmethylenebisphosphonate isobutanenitrile [...] , 4, 4 the [...] -azo dihydrogenmethylenebisphosphonate (4-cyano- valeric acid), 1, 1 the [...] -azo dihydrogenmethylenebisphosphonate (1- cyclohexane nitrile), t-hexyl peroxidises isopropylacrylamides single carbon ester, t-butyl peroxidises maleic acid, t-butyl peroxidises -3, 5, 5-trimethyl base oneself ester, t-butyl peroxidises laurel ester, 2, 5-dimethyl -2, 5-bis (3-methyl benzoyl peroxide) hexane, t-butyl peroxidises-2-ethyl hexyl single carbon ester, t-hexyl peroxidises benzoate, 2, 5-dimethyl -2, 5-di (benzoyl peroxide) hexane, t-butyl peroxidises benzoates, dibutyl peroxidises trimethyl adipic acid ester, t-pentylimidazolium peroxidises is caprylate , t-pentylimidazolium peroxidises different ninth stem diethylene glycol dinitrate , t-pentylimidazolium peroxidises benzoic acid ester, of such compound can be used alone, also can be mixing 2 or more. Wherein is preferably 1 minute half-life temperature is 90-175 the [...] , and a weight-average molecular weight of 180-1000 of the peroxyester derivatives or diacyl peroxide. Here, "1 minute half-life temperature" refers to a half-life of 1 minute temperature, "half-lives" refer to the concentration of the compound is reduced to half of the time when the bias. Free radical polymerization initiator of 1 minute half-life temperature is 90-175 the [...] , the adhesive composition of the invention is obtained by the process, the comparison with the prior art, the connecting resistance of can possess excellent. Furthermore, the adhesive composition of the invention in the mixed proportion of the radical polymerization initiator, is relative to 100 parts by mass of a thermoplastic resin, preferably 0.05-30 parts by mass, more preferably 0.1-20 parts by mass. The mixing ratio of the free radical polymerization initiator is less than 0.05 parts by mass of the time, will have free radical polymerization of the tendency of the rate of polymerization is reduced, adhesive composition of the tendency of insufficient hardening process, if the free radical polymerization initiator more than 30 parts by mass, the adhesive composition will be the tendency of the storage stability. Furthermore, in this invention the energy conferred by the shape of, and there is no special restriction, but can enumerate heat, electron beam, line γ, ultraviolet, infrared, visible light, microwave plasma. The invention by the relevant adhesive component, contains the above-mentioned thermoplastic resin, free radical polymerizable compounds and free radical polymerization initiator, and in 25 the ESR [...] in the measurement under the condition of having signal. ESR is electron spin resonance ( Resonance Spin Electron) abbrebytions, can be detected through the measurement of the material leaves tries in a free radical. In the invention of the "with a signal in the measurement of ESR", are those with spin density is 1.0 × 1016 spins/g signal intensity of the above. Spin density by the known concentration of 4-hydroxy -2, 2, 6, 6-tetramethyl-piperidine-1-oxyl the signal when the standard assay obtained after comparison of strength. In this specification the ESR signal, can be measured by the calculated under the following conditions. Using machine: ESP350 (corporate BRUKER, tradenames) Microwave frequency calculates : HP5351B (corporate PACKARD HEWLETT, tradenames) Magnetometer: ER035M (corporate BRUKER, tradenames) The central magnetic field of: 3490G near Magnetic field scanning range: 200G Modulation: 100kHz, 1G Microwave: 9.8GHz, 1mW The scanning time: 83.886s × 4 time Time constant: 327.68ms Cavity: TM100, cylindrical In the measurement of ESR, assay by not and state (solid, liquid, gas) limit, the state of the thin film can be carried out also under ESR measurement, however, film sample of the magnetic field to free radical of them display anisotropic, display a wide range of asymmetric signal. Here, this invention is that the assay is dissolved in a solvent solution of the ESR measurement, the use of solvent, as long as it is soluble can be assay , and there is no particular restriction, but preferably chloroform, chloroform use of this invention. Furthermore, the dissolved solution assay, may, if necessary, filtering particles and filler and other insoluble matter, the filtrate may also be only measuring the, measuring temperature is the normal temperature, but in order to film-like measurement when the ESR, in order to easily analyze low-temperature measurement can also be used, in the present invention the 25 [...] measuring ESR. Other adhesive ingredients in addition to the adhesive composition, when containing conductive particles also, adhesive component itself for measuring ESR with signal, so preferably, the conductivity-based metal component used in the particles, while ESR measurement with a signal, but such a case it is very difficult to obtain the effect of the present invention. Containing with the ESR signal of the adhesive component of the adhesive composition, of the free radicals contained in the presence of stabilizing. Generally speaking, free-radical polymerization, because the growth free radical has a high reactivity, it is difficult to control the polymerization rate, however, the adhesive composition comprising stable free radical (hereinafter referred to as "stable free radical") time, can control the speed of free radical polymerization. Stabilized free compound, because what could be described as of a stable free radical compounds, and the end of the initial free radical polymerization or free radical has a very high reactivity, therefore, can be nearly completely retention of a stable free radical from the free-radical polymerization initiator of the free radical generated by the, therefore, the stable free radical for residue, can completely inhibit free-radical polymerization of the beginning and to, after the stable free radical is consumed completely, to free-radical polymerization. The result, from the heating can be ensured from the start of hardening to bonding between the time the flow of the adhesive composition, can be expanded in the time domain the process, the current generated by the to the role of the stable free radical, and is not limited to the role of the above-mentioned the estimated. The adhesive component in the adhesive composition, for g value in measurement of ESR, preferably 2.0000-2.0100, this g value by the equation below (A) obtained. G=h ν / βH (A) Here, formula (A) in, Planck constant said h (6.6261 × 10-34 Js), ν said number of microwave frequency (Hz), β expressed poore magneton (9.2740 × 10-24 J/T), H said resonance magnetic field (T). Moreover, the ESR signal is based on the core is rotated, or free radical of the mutual action, can be imparted to the divided signal, at this moment the center of the split signal for resonance magnetic field, in addition, gives a wide range of signal and complex the signal, the low magnetic field side of the signal and the highest magnetic field side signals as a signal between the center of the center, to the resonance magnetic field. In the measurement of the ESR, g value is 2.0000-2.0100, adhesive component that generally the containing an organic compound has a free radical was frankly told π. The adhesive composition of the present invention with the free radical kind of, be more effective in the process of expansion the effect of play in the time domain, g value is 2.0040-2.0090, more effect can be the expansion of the time domain the process, therefore, preferred. In order to make the adhesive having the value g as described above, can be enumerated adding transition metal and ferromagnetic substance , stable free radical of an organic compound of the method, the adhesive composition of the present invention, the most preferably add the stable free radical compound. The method of the invention uses the stable free radical compound, as long as it is has a π was frankly told free radical can be an organic compound, there is no special limitation, known compounds can be used. Stable free radical compound, can be listed with nitrogen-oxygen (aminoxyl) yl (> N-O·)oxynitride, its specific example, can be enumerated the following general formula (B) of the nitrogen oxide compound. Here, formula (B) in, R1 represents a hydrogen atom, hydroxy, amino, carboxyl, cyano, thiophosphoro isocyanate group, the carbon number 1-10 alkyl, aryl group, the carbon number 1-20 alkoxy, ester or amido, X1, X2, X3 and X4 each independently represents a hydrogen atom or a carbon number 1-5 alkyl. More specifically, the following formula may be mentioned nitrogen-oxygen compound (1)-(16) the said compounds, can be enumerated polyamine, polyester, polyacrylate, and the like on the side chain, into the from the above-mentioned general formula (B) compound from the R1 or X4 of the 1 base stock polymer as a substituent. The above-mentioned stable free radical compound can be used independently 1 kind of, or combined 2 the above. The mixing ratio of the stable free radical compound, is relative to 100 parts by mass of a thermoplastic resin, is preferably 0.01-10 parts by mass, more preferably 0.02-0.5 parts by mass. This mixing ratio if not to the 0.01 parts by mass, it is difficult to produce the nitrogen-oxygen compound effectiveness of the above-mentioned effect, if more than 10 parts by mass, with the adhesive composition will be the tendency of a hardening is reduced. Preferably the adhesive composition of this invention containing conductive particles, by containing conductive particles, conductivity can be imparted to the adhesive composition, therefore, adhesive composition of this invention can be used as a semiconductor and the like and the circuit electrodes and electronic fax in the field of industry to use conductive adhesive. The method of the invention uses the conductive particle, as long as it can be the conductivity can be electrically connected with, and there is no particular limitation, the conductive particles can be cited for example, contain Au, Ag, Ni, and solder cu of metal, or carbon. Furthermore, also can be in a non-conductive glass, ceramic, plastic and the like as nuclear, the kernel for incasemented the above-mentioned metal particles and carbon material, wherein the preferred metal is a heat fusible metal, or plastic as the lens nucleus, coated metal or carbon. Such situation, because by heating and pressurizing the adhesive composition to make it deform the hardened more easily, is electrically connected to the between the electrode, electrode and increase the contact area of the adhesive composition, can improve the conductivity between the electrodes. Moreover, adhesive composition of the present invention, may also contain the above-mentioned conductive particles such as polymer resin for the surface of the coated layered particle. The state of the layered particles of conductive particles added in the adhesive composition, even if the amount of conductive particles is increased, because the resin-coated, the conductive particles can be more suppressed by the contact between the short circuit, can also improve the insulating quality of the electrode circuit. Furthermore, can be used independently 1 or a combination of 2 or more types of conductive particles and using such layered particle. The average particle diameter of the conductive particles, the dispersion and conductive point of view, preferably the 1-18 m. Furthermore, the mixing ratio of the conductive particle, relative to 100 parts by mass of a thermoplastic resin, preferably 0.5-30 parts by mass. And the mixing ratio of the conductive particle, relative to 100 volume % of the adhesive composition, is preferably 0.1-30 volume %, more preferably 0.1-10% volume. The mixing ratio of the conductive particles is less than 0.1% of the volume, will have to be fully the tendency of the conductivity, more than 30% in volume, there will be the tendency of a short circuit. Furthermore, the mixing ratio of the conductive particles (volume %), is based on the 23 when [...] of the adhesive composition before the volume of the each component of the decision. The volume of each component, can be utilized by the weight of the converted into the volume is, in addition, can be fully put into complete the components of the appropriate solvent (water, ethanol, etc.) in the container, into the component, from the increase of the method to calculate a volume. Furthermore, adhesive composition of the present invention, may also be appropriate to add coupling agent and adhesion-improving agent, leveling agent, adhesive adjuvant, therefore, can be more significant play the effect of this invention, can give better adhesion and the operability. Specifically, can enumerate alkoxy silane derivatives and silicon amine alkane derivatives, wherein following preferred formula (C) the said compound. Here, formula (C) in, R6, R7 and R8 each independently represents a hydrogen atom, the carbon number 1-5 alkyl, carbon number 1-5 alkoxy, carbon number 1-5 alkoxy carbonyl, or aryl, R9 represents a hydrogen atom or a methyl, said p 1-10 integer. And, this general formula (C) in, when the R6 to carbon number 1-5 alkyl or aryl, R7 and R8 each independently stands for 1-3 alkoxy, for p 2-4 time, because more excellent cementability and is connected with the resistance, therefore, preferred. Moreover, general formula (C) can be expressed by the single use of the compound 1 a, can be also mixed 2 or more. Furthermore, adhesive adjuvant can be a phosphoric acid ester derivative, this phosphorus acid ester derivative, specifically, preferably the following general formula (D) a compound expressed by. Here, formula (D) in, R2 represents a hydrogen atom or a methyl, n expressed 1-10 integer, said m 1 or 2 integer. The soot can be used independently cementation auxiliary rib medicinal preparation 1 kind of, or mixing 2 or more kinds of compounds using. Adhesive composition of the present invention, in addition to other material can be added, if necessary, for example, can be the combination of the adhesive improving agent cementability crossing linking rate , thereby more improving the binding strength. In other words, in addition to the (meth) acryloyl group in a free-radical polymerizable compound, can also add having allyl, maleic anhydride compression imino, vinyl capable of free radical polymerization of functional group of the compound, in particular, can be enumerated N-vinyl imidazole, N-vinyl pyridine, N-vinylpyrrolidone, N-vinyl formamide, N-vinyl caprolactam, 4, 4 the forks the pair[...] -ethylene (N, N-dimethyl aniline), N-vinyl acetamide, N, N-dimethyl acrylamide, N-isopropyl acrylamide, N, N-diethyl acrylamide, and the like. Moreover, these adhesion-improving agent can be used independently 1 or a combination of 2 or more kinds. Adhesive composition of the present invention, can be simultaneously used for single-functional (meth) acrylic ester, fluidity improving agent, therefore, the connection can be more improved the fluidity of the adhesive composition. Specifically, can enumerate pentaerythritol (meth) acrylate, 2-cyanoethyl (meth) acrylate, cyclohexyl (meth) acrylate, bicyclic pentene (meth) acrylate, b cyclopentene propoxycyclohexyl ethyl (meth) acrylate, 2-(2- ethoxy group ethoxy group) ethyl (meth) acrylate, 2-ethoxy ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-hexyl (meth) acrylate, 2-hydroxy ethyl (meth) acrylate, hydroxy propyl (meth) acrylate, isobornyl (meth) acrylate, (meth) acrylic acid ester different decyl , different octyl (meth) acrylate, n-lauryl (meth) acrylate, 2-methoxy ethyl (meth) acrylate, 2-phenoxyl ethyl (meth) acrylate, four tetrahydrofurfuryl (meth) acrylate, 2-(methyl) c acyloxy ethyl phosphate, N, N-dimethyl amino ethyl (meth) acrylate, N, N-dimethyl amino propyl (meth) acrylate, (meth) acryloyl morpholine. Moreover, these fluidity improving agent can be used independently 1 or a combination of 2 or more use. Moreover, adhesive composition of this invention can also improve the stress relaxation and the adhesion to the rubber material and, in particular, can be enumerated polyisoprene, polybutadiene, carboxyl terminal polybutadiene, hydroxy terminal polybutadiene, 1, 2-polybutadiene, carboxyl terminal 1, 2-polybutadiene, hydroxy end 1, 2-polybutadiene, acrylic rubber, styrene-butadiene rubber, hydroxy end styrene-butadiene rubber, acrylonitrile-butadiene rubber, the end of the polymer containing carboxyl, hydroxyl, (meth) acryloyl or morpholinyl acrylonitrile-butadiene rubber, carboxyl melts the nitrile rubber, hydroxy termination poly (oxy propylene), alkoxy silicon alkyl termination poly (oxy propylene), poly (oxy-four extension methyl) weth, polyolefin weth, poly-ε-caprolactone. The above-mentioned rubber-based material, the point of view of improving adhesion, preferably the side chains containing or tail end of the high polarity of the cyano group of the functional group, carboxyl rubber oak , from the point of view of the improvement of the fluidity is concerned, is preferably liquid. Specifically, can enumerate liquid acrylonitrile-butadiene rubber, the end of the polymer containing carboxyl, hydroxyl, (meth) acryloyl or morpholinyl of the liquid acrylonitrile-butadiene rubber, liquid nitrile rubber. Acrylonitrile content of the polar group, preferably these rubber-based material the overall 10-60 mass %, furthermore, these rubber-based material can be used independently 1 or a combination of 2 or more use. Moreover, adhesive composition of the present invention, can be and-butyl catechol t, t-butyl phenol, the-methoxyphenol p polymerization of the representative of the additive such as forbids the medicinal preparation , therefore, can more improve the storage stability of the adhesive composition. Adhesive composition of the present invention is the liquid at room temperature, can use thickener shape , when the is solid at room temperature, pastel after heating, or the use of a solvent can also be the pastel thereof. The solvent can be used, as long as it is not react with the adhesive composition, and of exhibiting sufficient solubility can be, and no special limit, preferably the boiling point under normal pressure is the 50-150 [...]. If the boiling point of the 50 [...] , at room temperature the solvent is easy to volatilize, making the latter film will be the tendency of the deterioration of operability; moreover boiling point is more than 150 the [...] , the solvent is very difficult to volatilize, will be unable to get adequate after bonding the tendency of the bonding strength of the. Adhesive composition of the present invention, the warning light can be used for forming a thin film, the thin film-like adhesive, bonding composition may be added to the mixed solution of the solvent, and the like, applied to the fluororesin film, polyethylene terephthalate, paper and so on butyrin of the film on the base material, or impregnation of the non-woven fabric, such as the above-mentioned mixed solution is put in the peeling-off on the substrate, obtained after removing the solvent, and the like. The thin-film of the adhesive composition is made, the operability is more convenient. Furthermore, in the adhesive composition of the present invention adding conductive particles to produce local thin film, can make an anisotropic conductive film, the anisotropic conductive film, for example is placed on the substrate between the electrodes of the opposite direction, can be by heating and pressing two electrodes sticking , is electrically connected at the same time. Here, of the electrode-forming base plate, can be suitable for the use of semiconductor, glass, ceramic, inorganic, polyimide, organic matter such as polycarbonates, glass/epoxy composite of each combination. Moreover, the invention can be the adhesive composition is bonded by heating and pressurizing, heating temperature and there is no particular restriction, but to the 50-190 [...] temperature preferably, pressure so long as does not damage the adhesive can be the scope of the, general is preferably 0.1-10 MPa, the heating and pressurizing preferably in 0.5 seconds -120 seconds in the range of. Through this invention, can be at a low temperature can be provided to fully and rapidly carry out hardening treatment, the process of conducting a curing treatment of the time-domain is wide, the characteristic of having a sufficiently stable (is connected with the resistance and bonding strength), and fully excellent storage stability of the adhesive composition. Moreover, adhesive composition of the present invention, because the low temperature can be sufficiently rapid hardening treatment, the process of conducting a curing treatment of the time-domain is wide, the characteristic of having a sufficiently stable (is connected with the resistance and bonding strength), it can be suitable for use as a circuit-connecting material. For example, the circuit of the circuit member 1st and 2nd electrodes circuit member is electrically connected with the circuit of the electrode, the circuit component of the soot to the configuration state, the adhesive composition of the present invention one of the parties to the circuit electrode, and circuit electrodes of the other party can be carried out through free-radical polymerization reaction is electrically connected. The use of such adhesive composition is used as the circuit-connecting material, can be carried out within a short period of time are electrically connected, even if the connection change of the process temperature and time, but also can be an adhesive strength and stability of the connection resistance, the connecting material, in addition, can also inhibit circuit is connected with the process of the material properties with the elapse of time is reduced. And, if the circuit is connected with the material containing conductive particles, electrically connected can be displayed by an anisotropic, for electrode can be used as a circuit an anisotropic conductive circuit connection material to use. The above-mentioned circuit-connecting material, can be used as the different thermal expansion coefficients of the different types of the circuit connection of the anisotropically electrically conductive material, in particular, can be used as the anisotropic conductive adhesive, silver paste, silver thin film, the material of the circuit connection of the representative, CSP with an elastomer, a filler material at the bottom of the CSP, cloth LOC the semiconductor element of the representative of the use of the adhesive material. Circuit member connection structure Furthermore, on the circuit member of the present invention is suitable for a connecting structure of the embodiment of the. Figure 1 said circuit member of the present invention one of the connecting structure of the outline of the embodiment of the cross-sectional Figure, as shown in Figure 1, the embodiment of a circuit member connection structure 1, to possess the 1st circuit member 20 and 2nd circuit component 30, circuit member 1st 20 and 2nd circuit member 30 between, is provided with these of the circuit connection of the incoming call is connected with the component 10. 1st circuit member 20 with 1st circuit substrate 21 and formed on the circuit substrate 21 the main surface 21a of the circuit electrode 1st 22. Moreover, circuit substrate 21 the main surface 21a is, the insulating layer can be formed depending on the circumstances (not shown). On the other hand, circuit member 2nd 30 with 2nd circuit substrate 31 and a 2nd circuit substrate 31 the main surface 31a of the circuit electrode 2nd 32. Furthermore, circuit board 31 of the principal plane 31a is, the insulating layer can be formed depending on the circumstances (not shown). 1st circuit member 20 and 2nd circuit member 30, is formed to be electrically connected as long as the electrode is necessary, and there is no particular limitation. Specifically, in the liquid crystal display panel can be used, such as ITO electrode is formed in the glass or plastic substrate, printed circuit board, ceramic wiring board, the flexible wiring board, such as semiconductor silicon chip. These, if necessary, can be combined to use. As such, this embodiment is, can be printed by using the organic matter such as polyimide and matches Lu Ban the material is representative of, and with such as copper, and metal of occurrence ITO (indium tin oxide, indium tin oxide), silicon nitride (SiNx), silicon dioxide (SiO2) the inorganic material, such as of the condition of a surface of a wide variety of circuit member. Circuit connection member 10 comprises an insulating material 11 and conductive particles 7 ; conductive particles 7, not only the 1st to the disposed on the circuit electrodes 22 and 2nd circuit electrode 32 between, also is disposed on the main surface 21a, 31a between. The circuit of this embodiment is connected with the structure of the component 1 in, 1st circuit electrode 22 and 2nd circuit electrode 32 through the conductive particles 7 for electric connection, therefore, can be sufficiently reduce 1st circuit electrode 22 and 2nd circuit electrode 32 the resistance of the connection between the, therefore, 1st circuit electrode 22 and 2nd circuit electrode 32 to flow of a current between the be carried out smoothly, which can fully play has the function of the circuit. Furthermore, by making the conductive particles 7 are the above mixing ratio, can be displayed by the anisotropic electrically connected. Moreover, circuit connection member 10 not containing conductive particles 7 is, through the circuit electrode 1st 22 and 2nd circuit electrode 32 or very close to the direct contact and are electrically connected, the circuit electrode 1st 22 and 2nd circuit electrode 32 the amount of flow between the electric current of the desired. Circuit connection member 10 containing the above-mentioned adhesive composition because the circuit-connecting material of the process, so the circuit member 1st 20 or 2nd circuit member 30 speaking, circuit connection member 10 to the connection strength becomes high, but, the resistance is sufficiently reduced, and this state can be sustained during characterized. Therefore, 1st circuit electrode 22 and 2nd circuit electrode 32 between the long-term reliability of the electrical characteristics can be fully becomes high. Circuit component manufacturing method of the connection structure Furthermore, on the above-mentioned circuit component manufacturing method of the connection structure, with reference to steps of the plan Figure 2 to note. First, prepared to the above-mentioned 1st circuit member 20 and the film-like material for connecting circuit 40 (reference fig. 2 (a)). Film-like circuit connecting material 40, is to connect the circuit material forming the film-like success. The circuit-connecting material containing adhesive component 5, conductive particles 7, the adhesive component 5 using the above-mentioned adhesive component correlated to this invention. Moreover, circuit connection material even not containing conductive particles 7, this circuit-connecting material also can be used as an insulating adhesive used in the anisotropic conductive adhesive, sometimes special called NCP ( Paste Non-Conductive, non-conductive paste). Furthermore, circuit connection material containing conductive particles 7 time, sometimes this circuit-connecting material of the ACP (Anisotropic Conductive Paste, anisotropic conductive paste). Film-like material for connecting circuit 40 for the preferred thickness of the the 10-50 m, thin filmlike material for connecting circuit 40 if insufficient thickness of the 10 m, will be a circuit electrode 22, 32 is connected with the circuit between the tendency of the material filling is insufficient, in addition, if more than 50 the m, will be a circuit electrode 22, 32 of the adhesive composition cannot be ruled out completely, the electrode of the circuit 22, 32 to ensure communication between the tendency to become difficult. Furthermore, the film-like material for connecting circuit 40, is placed in 1st circuit member 20 forming circuit electrode 22 on the surface of the, furthermore, thin film-like circuit connection material 40 attached to the support body on the (not shown), the film-like material for connecting circuit 40 side, faces the 1st circuit member 20 is placed under the condition of the circuit member 1st 20 on. At this moment, because the film-like material for connecting circuit 40 has a film-like shape, therefore, the operation is easy, therefore, can be easily so that the film-like material for connecting circuit 40 is interposed between the 1st circuit member 20 and 2nd circuit member 30 between, and can be conducted easily 1st circuit member 20 and 2nd circuit member 30 connecting operation. Furthermore, in fig. 2 (a) of the direction of the arrow and A B pressurized thin filmlike material for connecting circuit 40, the film-like material for connecting circuit 40 the false connection (with reference to Figure 2 (b)) for 1st circuit member 20, at the moment, can be the same heating side pressure, the heating temperature, however, is not to make film-like circuit connecting material 40 in the temperature of the hardening the adhesive composition, that is, than the free-radical polymerization initiator of the free radical generating the temperature of the low temperature. Furthermore, as shown in Figure 2 (c) shows, the 2nd circuit member 30, the face to a 1st 2nd circuit circuit member 20 is placed in the film under the condition of the circuit-connecting material 40 on. Furthermore, thin film-like circuit connection material 40 attached to the support body on the (not shown), the supporting web of the after the stripping 2nd circuit member 30 is placed in the film-like circuit connecting material 40 on. Furthermore, while heating the thin film-like material for connecting circuit 40, while in fig. 2 (c) and the direction of the-arrow A B is separated in the 1st and 2nd circuit member 20, 30 to pressurize, the heating temperature at this moment, as the free radical polymerization initiator can be the temperature of the free radical generating, by the, free radical generated in the radical polymerization initiator, the radical-polymerizable compound start the polymerization, as such, the film-like material for connecting circuit 40 conducting a curing treatment, the connection of the genuine, is as shown in Figure 1 the circuit member connection structure. For example, the heating temperature is the 90-200 [...] , such as connection time 1 second -10 minutes, such condition can be in accordance with the use, adhesive composition, properly chosen circuit component, the after-hardening can be carried out when necessary. If the above-mentioned approach, manufacturing circuit member connection structure, the connection of the circuit component in structure, can make the conductive particles 7 and mutual opposite direction of the electrode of the circuit 22, 32 the contact, can fully reduce the electrode of the circuit 22, 32 of the connection between the resistor. Furthermore, film-like circuit connecting material through the 40 heating, the circuit electrodes 22 and the circuit electrode 32 is the distance between the under the state of fully, adhesive component 5 a after hardening, insulating material 11, 1st circuit member 20 and 2nd circuit member 30 through the circuit connection member 10 is firmly connected. In other words, the structure of the circuit component in the connection of the, circuit is connected with the component 10 by containing the above-mentioned adhesive composition of the circuit connection of the material of the process, therefore, fully improve the circuit member 20 or 30 of the circuit connection of the member 10 the bonding strength of the, and can fully reduce the electrode of the circuit 22, 32 is connected between the resistor. Furthermore, the circuit member connection structure, sustained during this state can be characterized. Therefore, the obtained circuit member connection structure, fully prevent the circuit electrode 22, 32 the distance between the change with the elapse of time, the electrode of the circuit 22, 32 between the excellent long-term reliability of the electrical characteristics. Furthermore, adhesive component 5 can at least contain through heating free radical generating free radical polymerization initiator, can also use only light irradiation to produce free radical substituted radical polymerization initiator of the free radical polymerization initiator. At this moment, film-like circuit connecting material 40 when the hardening treatment, to replace the heating can also be irradiated with light. Other, can be used when necessary through the ultrasonic wave, electromagnetic wave, free radical generating free radical polymerization initiator. Furthermore, also can be used epoxy resin and latent hardener as the adhesive component 5 in a hardening component. Furthermore, the above-mentioned embodiment, the use of film-like circuit connecting material 40 producing circuit connecting structure of the component, but it can also use of the circuit connection of the thin-film-like material is formed to replace the film-like material for connecting circuit 40, at this time the circuit-connecting material dissolved in a solvent, the solution is applied to the circuit member 1st 20 or 2nd circuit member 30 a rear of the drying, can make the 1st and 2nd circuit member 20, 30 are separated by circuit connection material. Furthermore, other conductive materials can be used to replace the conductive particles 7, as the other conductive material, can enumerate particulate or short fiber of carbon, such as Ni-Au plating of the metal line and the like. Semiconductor device Furthermore, on the semiconductor device of this invention embodiment. Figure 3 is diagrammatic cross-sectional view, as shown in Figure of said one of the semiconductor device of the embodiment 3 shown in, the semiconductor device of this embodiment 2 is supplied with a semiconductor element 50 and of becoming a semiconductor substrate of a support member 60, the semiconductor element 50 and the base plate 60 between, will set up and is electrically connected with the semiconductor element is connected with member 80. Furthermore, the semiconductor element is connected with member 80 stacked on the base plate 60 of the principal plane 60a is, the semiconductor element 50 more laminated on the semiconductor element is connected with member 80 is. Base plate 60 with circuit pattern 61, circuit pattern 61 is the base plate 60 of the principal plane 60a is, separate the semiconductor element is connected with member 80 or directly with the semiconductor element 50 are electrically connected, and then, through the sealing material 70 in a closed, to form a semiconductor device 2. Semiconductor element 50 of the material and no special limitation, but can use silicon, germanium the 4 family of semiconductor element, GaAs, InP, GaP, InGaAs, InGaAsP, AlGaAs, InAs, GaInP, AlInP, AlGaInP, GaNAs, GaNP, GaInNAs, GaInNP, GaSb, InSb, GaN, AlN, InGaN, the InNAsP III-V group compound semiconductor element, HgTe, HgCdTe, CdMnTe, CdS, CdSe, MgSe, MgS, ZnSe, the ZeTe II-VI group compound semiconductor element, and various kinds of semiconductor elements such as CuInSe (ClS). Semiconductor element is connected with member 80 comprises an insulating material 11 and the conductive particles 7. Conductive particles 7 not only disposed on the semiconductor element 50 and circuit pattern 61 between, is also disposed in the semiconductor element 50 and principal plane 60a between. The semiconductor device of this embodiment 2 in, the semiconductor element 50 with the circuit pattern 61, the conductive particles 7 are electrically connected, the semiconductor element 50 and circuit pattern 61 connection resistance is fully reduce, therefore, the semiconductor element 50 and circuit pattern 61 to flow of a current between the be carried out smoothly, can sufficiently play a semiconductor has the function. Furthermore, by making the conductive particles 7 are the above mixing ratio, can be displayed by the anisotropic electrically connected. Furthermore, semiconductor element is connected with member 80 not containing conductive particles 7 time, in order for the semiconductor element 50 with the circuit pattern 61 a desired amount by the flow of electric current, can make the its direct contact or very close to for electric connection. Semiconductor element is connected with member 80, containing the above-mentioned adhesive because the components of the process, therefore, fully improve the semiconductor element 50 and the base plate 60 of the semiconductor element is connected with the component 40 bonding strength, and can fully reduce semiconductor element 50 and the circuit pattern 61 resistance of the connection between the, in addition, this state can be sustained during characterized, therefore, can fully improve the semiconductor element 50 and the base plate 60 of the long-term reliability of the electrical characteristics. Method of manufacturing semiconductor device Then on the above-mentioned manufacturing method of semiconductor device. First of all, a circuit pattern is formed to 61 of the base plate 60, and the film-like semiconductor element is connected with material. Film semiconductor element is connected with the semiconductor element is connected with the material for the film formed by material forming. The semiconductor element is connected with material containing adhesive component 5, conductive particles 7, the adhesive component 5 using the above-mentioned adhesive component correlated to this invention. Furthermore, semiconductor element is connected with material not containing conductive particles 7 time, the semiconductor element is connected with material can be used as an insulating adhesive used in the anisotropic conductive adhesive, sometimes special called NCP ( Paste Non-Conductive). Furthermore, the semiconductor element is connected with material containing conductive particles 7 time, sometimes the semiconductor element is connected with material as ACP ( Paste Anisotropic Conductive). Film semiconductor element is connected with the thickness of the material is preferably the 10-50 m, thin film-like semiconductor element is connected with the material thickness of less than 10 the the m, will be a circuit pattern 61 and the semiconductor element 50 is connected with the semiconductor element between the tendency of the material filling is insufficient, in addition, more than 50 the m, the circuit pattern 61 and the semiconductor element 50 of the adhesive composition cannot be ruled out completely, the circuit pattern 61 and the semiconductor element 50 to ensure communication between the tendency to become difficult. Furthermore, the thin film-like semiconductor element is connected with material, is placed on the base plate 60 a circuit pattern is formed of the 61 surface, moreover, the thin film-like semiconductor element is connected with material is attached to the support on the (not shown), the film-like semiconductor element is connected with material side, faces the base plate 60 is placed on the substrate under the condition of 60 the upper. At this moment, because the film-like semiconductor element is connected with material has a film-like shape, therefore, the operation is easy, therefore, can be easily so that the film-like semiconductor element is connected with material is between base plate 60 and the semiconductor element 50 between, and can be easily carry on base plate 60 and the semiconductor element 50 connecting operation. Furthermore, pressurized thin film semiconductor element is connected with material, the thin film-like semiconductor element is connected with material false is fixed on the base plate 60, at this moment, can be the same heating side pressure, the heating temperature, however, is not to make film-like semiconductor element is connected with material in the temperature of the hardening the adhesive composition, that is, than the free-radical polymerization initiator of the free radical generating the temperature of the low temperature. Furthermore, the semiconductor element 50 is placed in the film-like semiconductor element is connected with material, moreover, the thin film-like semiconductor element is connected with material is attached to the support on the (not shown), the supporting web of the semiconductor component after the stripping 50 is placed in the film-like semiconductor element is connected with material. Furthermore, while heating the thin film semiconductor element is connected with the material, while the base plate 60 and the semiconductor element 50 is pressurized, the heating temperature at this moment, as the free radical polymerization initiator can be the temperature of the free radical generating, by the, free radical generated in the radical polymerization initiator, the radical-polymerizable compound start the polymerization, as such, the film-like semiconductor element is connected with material for hardening treatment, the connection of the genuine. The heating temperature is for example the 90-200 [...] , such as connection time 1 second -10 minutes, according to the use of these conditions, adhesive composition, properly selecting the number of the base plate, the after-hardening can be carried out when necessary. Furthermore, if necessary the resin seals the semiconductor element, at this time, resin sealing material is formed on the surface of the base plate, but can also be on the opposite side of the surface of the substrate to form a resin sealing material on the surface, as shown in Figure 3 can be obtained of the semiconductor device. If the above-mentioned approach, manufacturing a semiconductor device, in the semiconductor device, the conductive particles 7 and mutual opposite direction of circuit pattern 61 and the semiconductor element 50 the contact, can fully reduce circuit pattern 61 and the semiconductor element 50 the resistance of the connection between the. Furthermore, the semiconductor element is connected through the thin-film heating of the material, in the circuit pattern 61 and the semiconductor element 50 is the distance between the under the state of fully, adhesive component 5 a after hardening, insulating material 11, the base plate 60 and the semiconductor element 50 and the semiconductor element is connected with member 80 is firmly connected. In other words, in the semiconductor device, the semiconductor element is connected with member 80 containing the above-mentioned adhesive composition of the semiconductor element is connected with the process of the material, thereby fully improve the base plate 50 or semiconductor element 50 and the semiconductor element is connected with member 80 bonding strength, and can fully reduce semiconductor element 50 and circuit pattern 61 resistance of the connection between the. Furthermore, this semiconductor device, the continued during this state can be characterized. Therefore, the obtained semiconductor device fully prevent the circuit pattern 61, the semiconductor element 50 the distance between the change with the elapse of time, the circuit pattern 61, the semiconductor element 50 between the excellent long-term reliability of the electrical characteristics. Furthermore, the above-mentioned embodiment, the adhesive component 5 by heating can be used to produce free radical contains at least one radical polymerization initiator of the material, can also use only by the light irradiation to produce free radical substituted radical polymerization initiator of the free radical polymerization initiator. At this moment, film-like semiconductor element is connected with the hardening treatment of the material, can also replace the heating is irradiated with light. Other, can be used when necessary through the ultrasonic wave, electromagnetic wave, such as a radical polymerization initiator of the free radical generating, in addition, also can be used epoxy resin and latent hardener as the adhesive component 5 in a hardening component. Furthermore, the above-mentioned embodiment, the use of thin-film semiconductor component manufacturing a semiconductor device is connected with the material, but can also use not yet formed of thin-film semiconductor element is connected with material bonding material to replace the film-like semiconductor element, the semiconductor element is connected with material dissolved in a solvent, coating this solution on the base plate 60 or semiconductor element 50 after one of the, drying, can make the base plate 60 or semiconductor element 50 interval the semiconductor element is connected with material. Furthermore, other conductive materials can be used to replace the conductive particles 7, as the other conductive material, can enumerate particulate or short fiber of carbon, such as Ni-Au plating of the metal line and the like. The above, of the present invention on a suitable embodiment, but the invention is not arrests is restricted in these embodiments. Embodiment The following, detailed example of through the implementation of the invention, but the invention is not arrests is restricted in such embodiment. The modulation of the phenoxy resin solution The 40 parts by mass of a phenoxy resin (Union Carbide corporate, tradenames: PKHC, a weight average molecular weight of 45000), is dissolved in the glass container to the 60 parts by weight of methyl ethyl ketone (and optical pure medicine industrial corporate, tradenames: 2-butanone, purity 99%)in, modulation solid content 40 mass % of the phenoxy resin solution. Synthesis of amino-acetic acid resin The 450 parts by weight of the polybutylene terephthalate polyethylene adipate (polybuthylene adipate diol) (Aldrich Company system, a weight average molecular weight of 2000), 450 parts by weight of the (polyoxytetramethyleneglycol) polyoxytranethylene glycol (Aldrich Company system, the weight average molecular weight 2000), 100 parts by mass of 1, 4-butanediol (corporate Aldrich), dissolved in 4000 parts by weight of methyl ethyl ketone (and optical pure medicine industrial (unit) systems, tradenames: 2-butanone, purity 99%)in, at this time by adding 390 parts by weight of diphenyl methane diisocyanate (Aldrich Company system) to obtain the reaction solution, then, this reaction to 70 the reaction [...] 60 minutes, to obtain amido acetic acid resin. Moreover, at this moment the temperature-control use the oil bath (outside Arab League incites (unit) systems, tradenames: HOB-50D) carry out, the obtained amino acetic acid resin having a weight average molecular weight by GPC measuring result as the 35 million. Preparation of free-radical polymerizable compound Three poly isocyanate EO to modified di-acrylate (east Asian synthetic (unit) systems, tradenames: M-215), amino acetic acid acrylate (co-prosperity society chemical (unit) systems, tradenames: AT-600) and 2-(meth) acryloxy ethyl phosphoric acid ester (co-prosperity society chemical (unit) systems, tradenames: P-2M). Preparation of free-radical polymerization initiator T-hexyl peroxidises-2-ethylhexyl ester (Japan grease (unit) systems, tradenames: perhexyl O). Preparation of stable free radical compounds Preparation 4-hydroxy -2, 2, 6, 6-tetramethyl-piperidine-1-oxyl (TEMPOL, dawn Denka (unit) systems, tradenames: LA7-RD), 4-acetamide -2, 2, 6, 6, -tetramethyl-piperidin-1-oxy (TEMPOL-NHAc, Tokyo chemical industrial (unit) systems), 2, 2, 6, 6, -tetramethyl-piperidin-1-oxy (TEMPO, and optical pure medicine industrial (unit) systems). Preparation of conductive particles The on the surface of the polystyrene particles, set thickness to reach the 0.2 m is composed of a layer of nickel formed by the, for the by the nickel on the surface of the layer, the thickness is 0.02 the the m layer of gold of, such a practice making an average particle size of 4 the proportion of m and 2.5 of conductive particles. Embodiment 1 In the above-mentioned 62.5 parts by mass of the phenoxy resin solution (containing 25 parts by mass of a phenoxy resin) in, mixed 25 parts by mass of the solid ingredients of amino acetic acid resin, a radical-polymerizable compound as 25 parts by mass of a M-215, 25 parts by mass of a AT-600, 5 parts by mass of a P-2M, the radical polymerization initiator 3 mass parts of perhexyl as a stable free radical compound O and 0.2 parts by mass of TEMPOL. The obtained dispersed and mixed in the solution of the above-mentioned conductive particles to obtain the adhesive composition, the mixing ratio of the conductive particles, relative to the total volume of the adhesive composition is 1.5 volume %. Furthermore, the obtained adhesive composition, using coating apparatus (khang well precision instrument (unit) systems, tradenames: SNC-S3.0) thickness coated on 80 the fluorine resin film m obtained after the coating, the coating film will then pass to the 70 to [...] 10 minutes of hot air drying, having a thickness of to 15 the film-like circuit connecting material of m. Embodiment 2 In addition to stable free radical compound mixed as 0.2 parts by weight of the substituted TEMPOL-NHAc 0.2 parts by mass of other than TEMPOL, with the embodiment of the remaining 1 likewise, film-like circuit-connecting material obtained. Embodiment 3 In addition to stable free radical compound mixed as 0.2 parts by weight of the substituted TEMPO 0.2 parts by mass of other than TEMPOL, with the embodiment of the remaining 1 likewise, film-like circuit-connecting material obtained. Embodiment 4 In addition to stable free radical compound mixed as 0.05 parts by mass to replace the TEMPOL 0.2 parts by mass of the outside, with the embodiment of the remaining 1 likewise, film-like circuit-connecting material obtained. Comparative example 1 In addition to not mixed as a stable free radical compounds other than TEMPOL, with the embodiment of the remaining 1 likewise, film-like circuit-connecting material obtained. The above-mentioned embodiments the comparison example of the adhesive composition of each component of the mixing ratio, are shown in table 1. Table 1 ESR measurement The obtained film-shaped circuit-connecting material, using electronic balance (METLLER corporate, tradenames: UMX2) weighing 70 mg, is placed on the add 1 ml chloroform (and optical pure medicine industrial (unit) systems, special grade reagent, purity 98%)of the glass container stirring. Such a practice, to obtain the thin film circuit is connected with the material is dissolved in chloroform solution, then the solution with filter paper (quantitative filter paper No. 5C, ADVANTEC dongyang corporate) filtering, the obtained filtrate containing adhesive component. The filtrate after degassing with nitrogen bubbling, the flat grid in ESR, use for ESR ESP350 (corporate BRUKER), microwave frequency calculates HP5351B (corporate ARD PACK HEWLETT), magnetometer ER035M (corporate BRUKER) and cylindrical TM100 cavity, ESR measuring adhesive component, the g value, this ESR measurement condition is set to the central magnetic field 3490G nearby, magnetic field scanning range 200G, modulation 100kHz, 1G, microwave 9.8GH, 1mW, the scanning time 83.886s × 4 time, time constant 327.68ms, 25 °C. Furthermore, the concentration of the substance with the standards of the known 4-hydroxy -2, 2, 6, 6-tetramethyl-piperidine-1-as a standard assay comparison of the signal strength, to the measurement of the spin density, through the above-mentioned approach the obtained results are shown in table 2. Table 2 Embodiment 1-3 adhesive component, the ESR measurement, obtain a 2.0000-2.0100 g value of the signal, on the other hand, comparative example 1 of an adhesive composition, the ESR can not be observed in the measurement of the signal. The connection of the circuit components of the structure First, prepared with 500 line width of the 25 m, 50 the distance between m, thickness 18 the circuit wiring of copper m flexible circuit board (FPC board), forming the integrateds the 0.2 m of indium tin oxide (ITO) glass substrate of a thin layer (ITO substrate, thickness 1.1 mm, surface resistance 20 subsidence/square), then, in the FPC between the base plate and the ITO substrate, the above-mentioned configuration of the film-like circuit-connecting material. Furthermore, using the thermo-compression sticks device (heating mode: hot-press temperature constant , Toray Company system shares Engineering limited), the temperature of the in, 3 MPa under the condition of, these laminated direction of the 10 seconds of heating and pressurizing, by the method, to the base plate and the FPC is connected ITO substrate process of the material through the circuit is electrically connected with the width of 2 mm of the circuit member connection structure, moreover, the temperature setting of the above-mentioned is the 160 [...] , the 180 [...] and 200 the of [...] 3 mode. The measurement of connection resistance The obtained circuit member connection structure of the circuit in the resistance of the connection between the, in the (1) just after bonding, and (2) after adhering the 80 [...] , 95% RH of high temperature and high humidity groove to be 120 hours after the moisture resistance test, use a multimeter (ADVANTEST corporate, tradenames: TR6848) measurement. Furthermore, in the electric resistance value is the resistance between the adjacent circuit 150 point of the average (x+ 3σ), results of which are shown in table 3. Measurement of bonding strength The obtained circuit member connection structure of the circuit in the strength of the connection between the, in the (1) just after bonding, and (2) after adhering the 80 [...] , 95% RH of high temperature and high humidity groove to be 120 hours after the moisture resistance test, pursuant to JIS-Z0237 the 90 degrees measuring exfoliated, assessment, here, the bonding strength of the measuring device using TENSILON UTM-4 (stripping speed 50 mm/min, 25 °C, dongyang [...] corporate), results of which are shown in table 3. Table 3 Embodiment use 1-4 of the film-like circuit-connecting material, the heating temperature, and just after bonding the connecting resistance of the wet test, display the value of the deviation is small, the heating temperature of the wide-range exhibits excellent electrical properties. Relative to this, the use of comparative example 1 of the film-like circuit-connecting material, the heating temperature becomes high in the range of large connecting resistance, the moisture resistance test, and a further rise in the connection resistance. Industrial availability According to the invention, may be provided in low temperature can be sufficiently quick hardening treatment, the process of conducting a curing treatment of the time-domain is wide, the characteristic of having a sufficiently stable (is connected with the resistance and bonding strength) of the adhesive composition, and using the same material of the circuit connection of the, circuit member connection structure and semiconductor device. An adhesive composition which contains an adhesive component comprising a thermoplastic resin, a radical-polymerizable compound, and a radical polymerization initiator, wherein the adhesive component exhibits a signal in the ESR measurement at 25°C. 1. A circuit-connecting material, which is used for making the the circuit is electrically connected between the electrodes of the circuit connection of the material, The circuit-connecting material comprising adhesive component of the adhesive composition, the binder ingredients comprising: a thermoplastic resin; a radical-polymerizable compound; π was frankly told free radical of an organic compound; and free radical polymerization initiator, The binder components in the 25 the ESR [...] in the measurement of the with the spin density is 1.0 × 1016 spins/g the signal of the signal strength of the above, in the measurement of ESR of the g value is 2.0000-2.0100, In the measurement in the ESR, from the adhesive composition is dissolved in chloroform and filtered undissolved substance in solution, using only the filtrate is measured, In the spin density through the known concentration of 4-hydroxy -2, 2, 6, 6-tetramethyl-piperidine-1-oxyl is for standard assay to the comparison of the determined signal strength. 2. Circuit-connecting material according to Claim 1, wherein free radical was frankly told π with the organic compound is a nitrogen-oxygen compound. 3. Circuit-connecting material according to Claim 1 or 2, wherein with respect to the 100 parts by mass of the thermoplastic resin, containing 50-250 parts by mass of the radical polymerizable compound, 0.05-30 parts by mass of the free radical polymerization initiator, and 0.01-10 parts by mass of the radical was frankly told π of the organic compound. 4. Circuit-connecting material according to Claim 1 or 2, wherein further containing conductive particles. 5. Circuit-connecting material according to Claim 4, wherein with respect to the 100 parts by mass of the thermoplastic resin, containing 0.5-30 parts by mass of the conductive particles. 6. A thin film circuit is connected with the material, characterized in that by the right requests 1-5 to any one of the circuit is connected with the material to form a sandwich layer cover is formed into a thin film. 7. A circuit member connection structure, characterized in that with: 1st is formed on the main surface of the circuit substrate a 1st 1st circuit components of the circuit electrodes, 2nd is formed on the main surface of the circuit substrate a 2nd 2nd of circuit components of the circuit electrodes, is set up in the main surface of the circuit substrate of the 1st and the 2nd between the main surface of the circuit substrate, so that the 1st and the 2nd circuit electrodes on the circuit electrodes to the configuration state of the circuit is electrically connected with the connecting member, The circuit is connected with the member for claim 1-5 to any one of the circuit-connecting material of the cured article. 8. A semiconductor device, characterized in that with: the semiconductor element, the substrate having the semiconductor element, is arranged in the semiconductor component and the substrate, making the semiconductor element is electrically connected with the substrate of the semiconductor element is connected with the component, The semiconductor element is connected with member is claim 1-5 to any one of the circuit-connecting material of the cured article. 9. As a kind of the adhesive composition used for making the circuit is electrically connected between the electrodes of the circuit connection of the application of the material, Containing adhesive component of the adhesive composition, the binder ingredients comprising: a thermoplastic resin; a radical-polymerizable compound; π was frankly told free radical of an organic compound; and free radical polymerization initiator, The binder components in the 25 the ESR [...] in the measurement of the with the spin density is 1.0 × 1016 spins/g the signal of the signal strength of the above, in the measurement of ESR of the g value is 2.0000-2.0100, In the measurement in the ESR, from the adhesive composition is dissolved in chloroform and filtered undissolved substance in solution, using only the filtrate is measured, In the spin density through the known concentration of 4-hydroxy -2, 2, 6, 6-tetramethyl-piperidine-1-oxyl is for standard assay to the comparison of the determined signal strength. 10. The application of the circuit-connecting material according to Claim 9, wherein the free radical was frankly told π organic compound of a nitrogen compound. 11. The application of the circuit-connecting material according to Claim 9 or 10, wherein said adhesive composition relative to 100 parts by mass of the thermoplastic resin containing 50-250 parts by mass of the radical polymerizable compound, 0.05-30 parts by mass of the free radical polymerization initiator, and 0.01-10 parts by mass of the radical was frankly told π of the organic compound. 12. The application of the circuit-connecting material according to Claim 9 or 10, wherein said adhesive composition further containing conductive particles. 13. The application of the circuit-connecting material according to Claim 12, wherein said adhesive composition relative to 100 parts by mass of the thermoplastic resin containing 0.5-30 parts by mass of the conductive particles.