具有跨接連接結構之晶片封裝元件及其製作方法

01-01-2019 дата публикации

Номер:

TW201901868A

Автор: 宋梅芳, 王曉莉, 秦義文, 范桂枝

Принадлежит: 台灣半導體股份有限公司

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/4 H01L21/48 H01L21/482 H01L21/4825 H01L21/484 H01L21/4842 H01L21/5 H01L21/56 H01L21/561 H01L22 H01L222 H01L2224 H01L2224/H01L2224/2 H01L2224/29 H01L2224/291 H01L2224/3 H01L2224/32 H01L2224/320 H01L2224/3205 H01L2224/32058 H01L2224/322 H01L2224/3224 H01L2224/32245 H01L2224/33 H01L2224/331 H01L2224/3318 H01L2224/33181 H01L2224/37 H01L2224/370 H01L2224/3701 H01L2224/37012 H01L2224/4 H01L2224/40 H01L2224/402 H01L2224/4024 H01L2224/40245 H01L2224/404 H01L2224/4049 H01L2224/40499 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7326 H01L2224/73263 H01L2224/8 H01L2224/83 H01L2224/839 H01L2224/8390 H01L2224/83907 H01L2224/84 H01L2224/843 H01L2224/8434 H01L2224/84345 H01L2224/8438 H01L2224/84385 H01L2224/9 H01L2224/92 H01L2224/922 H01L2224/9221 H01L2224/97 H01L23 H01L23/H01L23/1 H01L23/13 H01L23/3 H01L23/31 H01L23/311 H01L23/3114 H01L23/4 H01L23/49 H01L23/495 H01L23/4951 H01L23/49513 H01L23/49517 H01L23/4952 H01L23/49524 H01L23/4953 H01L23/49537 H01L23/4954 H01L23/49541 H01L23/4955 H01L23/49551 H01L23/4956 H01L23/49562 H01L24 H01L24/H01L24/2 H01L24/29 H01L24/3 H01L24/32 H01L24/33 H01L24/37 H01L24/4 H01L24/40 H01L24/8 H01L24/83 H01L24/84 H01L24/9 H01L24/92 H01L24/97 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/18 H01L2924/181

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/1 H01L23/13 H01L23/4 H01L23/49 H01L23/495 H01L23/4957 H01L23/49575 H01L24 H01L24/H01L24/8 H01L24/83

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