Semiconductor device and method for fabricating the same

01-02-2021 дата публикации

Номер:

TW202105625A

Автор: 施信益, 黃則堯, HUANG TSE-YAO, SHIH SHING-YIH, HUANG, TSE-YAO, SHIH, SHING-YIH

Принадлежит: 南亞科技股份有限公司

Контакты:

Номер заявки: 53-39-10810

Дата заявки: 31-10-2019

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a semiconductor substrate, a plurality of first set conductive elements separately positioned above the semiconductor substrate, a plurality of first set supporting pillars respectively correspondingly positioned between an adjacent pairs of the plurality of first set conductive elements, and a plurality of spaces respectively correspondingly positioned adjacent to the plurality of first set supporting pillars.

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/4 H01L21/48 H01L21/481 H01L21/7 H01L21/76 H01L21/764 H01L21/768 H01L21/7682 H01L21/7683 H01L21/76837 H01L21/7688 H01L21/76885 H01L21/7689 H01L21/76895 H01L21/8 H01L21/82 H01L21/823 H01L21/8234 H01L21/82347 H01L21/823475 H01L21/8238 H01L21/82387 H01L21/823871 H01L22 H01L222 H01L2221 H01L2221/H01L2221/1 H01L2221/10 H01L2221/104 H01L2221/1042 H01L2221/106 H01L2221/1063 H01L2224 H01L2224/H01L2224/0 H01L2224/03 H01L2224/034 H01L2224/0345 H01L2224/03452 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/056 H01L2224/0562 H01L2224/05624 H01L2224/0564 H01L2224/05647 H01L2224/0565 H01L2224/05657 H01L2224/0568 H01L2224/05684 H01L2224/1 H01L2224/13 H01L2224/130 H01L2224/1302 H01L2224/13022 H01L2224/131 H01L2224/1311 H01L2224/13111 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/311 H01L23/3114 H01L23/5 H01L23/52 H01L23/522 H01L23/5222 H01L23/5226 H01L23/528 H01L23/5283 H01L23/53 H01L23/532 H01L23/5329 H01L23/53295

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/764 H01L23 H01L23/H01L23/2 H01L23/28 H01L23/4 H01L23/48 H01L23/5 H01L23/52 H01L23/522 H01L23/5226 H01L23/53 H01L23/532 H01L23/5329

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