Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package

17-02-2005 дата публикации
Номер:
US2005037539A1
Автор:
Принадлежит:
Контакты:
Номер заявки: 04-86-9493
Дата заявки: 27-09-2004



An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.