Package on package (PoP) device comprising a high performance inter package connection

27-12-2016 дата публикации

Номер:

US09530739B2

Автор: Kyu-Pyung Hwang, Young Kyu Song

Принадлежит: Qualcomm Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/768 H01L22 H01L222 H01L2224 H01L2224/H01L2224/1 H01L2224/13 H01L2224/131 H01L2224/1310 H01L2224/13101 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L2224/16227 H01L2224/2 H01L2224/29 H01L2224/291 H01L2224/2919 H01L2224/3 H01L2224/32 H01L2224/322 H01L2224/3222 H01L2224/32225 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7320 H01L2224/73204 H01L2224/9 H01L2224/92 H01L2224/921 H01L2224/9212 H01L2224/92125 H01L2225 H01L2225/H01L2225/1 H01L2225/10 H01L2225/102 H01L2225/1023 H01L2225/104 H01L2225/1047 H01L23 H01L23/H01L23/5 H01L23/53 H01L23/538 H01L23/5384 H01L23/5386 H01L23/5389 H01L23/55 H01L23/552 H01L23/6 H01L23/60 H01L24 H01L24/H01L24/0 H01L24/00 H01L24/1 H01L24/13 H01L24/16 H01L24/2 H01L24/29 H01L24/3 H01L24/32 H01L24/7 H01L24/73 H01L24/9 H01L24/92 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L25/1 H01L25/10 H01L25/105 H01L25/5 H01L25/50 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/15 H01L2924/153 H01L2924/1531 H01L2924/15311 H01L2924/18 H01L2924/181

IPC - классификация

H H0 H01 H01L H01L2 H01L24 H01L24/H01L24/8 H01L24/83 H01L25 H01L25/H01L25/1 H01L25/10 H01L25/105 H01L25/5 H01L25/50

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