Semiconductor packaging and manufacturing method thereof

16-05-2015 дата публикации

Номер:

TW0201519390A

Автор: Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang, SHIH CHAO-WEN, WU KAI-CHIANG, YANG CHING-FENG, LIU MING-KAI, LIANG SHIH-WEI, WANG YEN-PING, SHIH, CHAO-WEN, WU, KAI-CHIANG, YANG, CHING-FENG, LIU, MING-KAI, LIANG, SHIH-WEI, WANG, YEN-PING

Принадлежит: Taiwan Semiconductor Mfg

Контакты:

Номер заявки: 03-16-10311

Дата заявки: 06-05-2014

The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI.

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/565 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/021 H01L2224/0217 H01L2224/02175 H01L2224/03 H01L2224/038 H01L2224/0382 H01L2224/03828 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/055 H01L2224/0554 H01L2224/05548 H01L2224/056 H01L2224/0562 H01L2224/05624 H01L2224/0564 H01L2224/05644 H01L2224/05647 H01L2224/0565 H01L2224/05655 H01L2224/0568 H01L2224/05684 H01L2224/1 H01L2224/10 H01L2224/101 H01L2224/1014 H01L2224/10145 H01L2224/11 H01L2224/113 H01L2224/1134 H01L2224/118 H01L2224/1184 H01L2224/11849 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13007 H01L2224/1302 H01L2224/13023 H01L2224/131 H01L2224/1311 H01L2224/13111 H01L2224/1314 H01L2224/13147 H01L2224/1315 H01L2224/13155 H01L2224/8 H01L2224/81 H01L2224/811 H01L2224/8119 H01L2224/81191 H01L23 H01L23/H01L23/2 H01L23/29 H01L23/291 H01L23/3 H01L23/31 H01L23/311 H01L23/3114 H01L23/315 H01L23/3157 H01L24 H01L24/H01L24/0 H01L24/03 H01L24/05 H01L24/1 H01L24/11 H01L24/13 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/01 H01L2924/010 H01L2924/0102 H01L2924/01029 H01L2924/1 H01L2924/12 H01L2924/120 H01L2924/1204 H01L2924/12042 H01L2924/18 H01L2924/181

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/60 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/488

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