Bump structure design for stress reduction

24-10-2017 дата публикации

Номер:

US09799582B2

Автор: Hsien-Wei Chen

Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/050 H01L2224/0502 H01L2224/05022 H01L2224/05027 H01L2224/051 H01L2224/0514 H01L2224/05147 H01L2224/0516 H01L2224/05166 H01L2224/0518 H01L2224/05181 H01L2224/05186 H01L2224/055 H01L2224/0554 H01L2224/05541 H01L2224/0557 H01L2224/05572 H01L2224/056 H01L2224/0564 H01L2224/05647 H01L2224/0565 H01L2224/05655 H01L2224/06 H01L2224/060 H01L2224/0603 H01L2224/0605 H01L2224/06051 H01L2224/061 H01L2224/0613 H01L2224/06131 H01L2224/0617 H01L2224/06179 H01L2224/1 H01L2224/11 H01L2224/118 H01L2224/1184 H01L2224/11849 H01L2224/13 H01L2224/130 H01L2224/1302 H01L2224/13022 H01L2224/135 H01L2224/1354 H01L2224/13541 H01L2224/14 H01L2224/140 H01L2224/1403 H01L2224/1405 H01L2224/14051 H01L2224/141 H01L2224/1413 H01L2224/14131 H01L2224/1417 H01L2224/14179 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L2224/16227 H01L23 H01L23/H01L23/2 H01L23/29 H01L23/293 H01L23/3 H01L23/31 H01L23/311 H01L23/3114 H01L23/317 H01L23/3171 H01L23/319 H01L23/3192 H01L23/5 H01L23/52 H01L23/525 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/06 H01L24/1 H01L24/13 H01L24/14 H01L24/16 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/3 H01L2924/35 H01L2924/351 H01L2924/3511

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/2 H01L23/29 H01L23/293 H01L23/4 H01L23/48 H01L23/482 H01L23/4824 H01L24 H01L24/H01L24/0 H01L24/05

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