Bonded structures

28-01-2020 дата публикации

Номер:

US10546832B2

Автор: Arkalgud R. Sitaram, Javier A. Delacruz, Liang Wang, Rajesh Katkar

Принадлежит: Invensas Bonding Technologies Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

B B8 B81 B81B B81B2 B81B22 B81B220 B81B2207 B81B2207/B81B2207/0 B81B2207/01 B81B2207/012 B81B2207/09 B81B7 B81B7/B81B7/0 B81B7/00 B81B7/003 B81B7/0032 B81C B81C1 B81C1/B81C1/0 B81C1/00 B81C1/002 B81C1/0026 B81C1/00269 B81C1/0029 B81C1/00293 B81C2 B81C22 B81C220 B81C2203 B81C2203/B81C2203/0 B81C2203/01 B81C2203/019 B81C2203/03 B81C2203/035 H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/05 H01L2224/055 H01L2224/0555 H01L2224/05551 H01L2224/05552 H01L2224/05555 H01L2224/0557 H01L2224/05571 H01L2224/056 H01L2224/0564 H01L2224/05647 H01L2224/0568 H01L2224/05686 H01L2224/06 H01L2224/060 H01L2224/0605 H01L2224/06051 H01L2224/061 H01L2224/0613 H01L2224/06135 H01L2224/0615 H01L2224/06155 H01L2224/0616 H01L2224/06165 H01L2224/065 H01L2224/0650 H01L2224/06505 H01L2224/08 H01L2224/081 H01L2224/0812 H01L2224/08121 H01L2224/082 H01L2224/0823 H01L2224/08237 H01L2224/2 H01L2224/29 H01L2224/290 H01L2224/2901 H01L2224/29019 H01L2224/8 H01L2224/80 H01L2224/800 H01L2224/8001 H01L2224/8004 H01L2224/80047 H01L2224/803 H01L2224/8035 H01L2224/80357 H01L2224/808 H01L2224/8089 H01L2224/80895 H01L2224/80896 H01L2224/809 H01L2224/8094 H01L2224/80948 H01L23 H01L23/H01L23/1 H01L23/10 H01L23/4 H01L23/49 H01L23/498 H01L23/4983 H01L23/49838 H01L23/5 H01L23/52 H01L23/528 H01L23/53 H01L23/532 H01L23/5322 H01L23/53228 H01L23/5324 H01L23/53242 H01L23/56 H01L23/562 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/06 H01L24/08 H01L24/2 H01L24/29 H01L24/8 H01L24/80 H05 H05K H05K1 H05K1/H05K1/1 H05K1/11 H05K1/111

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/0 H01L23/04 H01L23/047 H01L23/1 H01L23/10 H01L24 H01L24/H01L24/8 H01L24/83

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