FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES

[Of the invention disclosure]

[Is the problem of invention]

Anisotropic for terminal is made from conductive material a flip-chip mounting the, semiconductor chip and the circuit substrate and electrical connection between electrode terminal, into the substrate circuit of semiconductor chip as the characteristic of each can be degraded and absolutely a semiconductor layer is formed on, then. problems like.

Said anisotropic conductive material a, the conductive particles into a resin to thereby obtain is the particles are uniformly dispersed in the but, according to push semiconductor chip to a circuit substrate, dispersed electroconductive particles is, an electrode terminal of semiconductor chip and the circuit substrate by physical contact to, of opposing electrodes between terminals the electrical connection enables while, anisotropic conductive material into the resin by, between electrode-terminal adjacent. while ensuring insulating properties, and a.

However, electroconductive particles is dispersed evenly in a resin since the, of opposing electrodes terminal for continuity that contribute to the electroconductive particles to the mike and the portion thereof, stable conductive condition electrical connection is arranged to obtain sufficient reliability. a problem that cannot be obtained for a surface. Electrode-terminal adjacent e.g. also is a resin are insulated with even though the, of opposing electrodes terminal for continuity contributing to no electrical electroconductive particles is dispersed in resin, sufficient insulating from the outside, the likehood of.

I.e., anisotropic for terminal is made from conductive material a flip-chip mounting the, 5,000 of the section exceeds a can connection terminal LSI chip is reduced to 0.2 to 1mtorr to, it achieves the object of designing a to be solved by the reliability of the member left exposed to.

The present invention refers to it is in view at this point, next generation LSI applicable to flip-chip mounting, productivity and reliability, high flip chip mounting method for the reductive alkylation at the c between oxide and the basic method method for providing connection in.

[Constitution: means]

The flip chip mounting method of the present invention, and connection terminals on a circuit board b which is for plurality opposed machine body frame are placed at the semiconductor chip having, for connecting circuit board terminal the semiconductor chip because the semiconductor chip electrode section within a battery is electrically connected to the flip chip mounting method in, circuit board and the semiconductor chip clearances between the, a of conductive particles and a bubble containing the number 1 which feed resin to a process and, heated fluid obtained by heating a fluid resin, resin contained in to generate microbubbles from bubble generating process and number 2, number 3 semiconductor chip to a circuit substrate with intervals for pressing process and, resin to cure at a pattern number 4, resin process number 2, bubble generator generated in a bubble subject to growth of the bubble by outer and nuts by, the semiconductor chip because the semiconductor chip terminal for connecting circuit board electrode terminal between and self-assembled, process number 3, between the terminals self-assembled into a resin to thereby obtain the conductive particles contained in the conductive by come into contact with each other between terminals electrically connected to each inner bump part and, process number 4, between terminals resin is cured to thereby semiconductor chip to a circuit substrate characterized in that are secured to the.

Wherein said bubble, a positive-type chemically, resin is heated is made of a material possessing a boiling when it is preferable that the. Also, a positive-type chemically bubble, 2 other-boiling point comprise at least one type of material is. Furthermore, bubble, a positive-type chemically, resin is heated when bubble occurrence system pyrolysis by of generating a gas is comprise of a material. For example, bubble, a positive-type chemically decisions are made with a compound containing, when heated and sets the resin degrades when generate water vapor.

In a preferred embodiment, said number 2 process, circuit board so as to change a gap of a semiconductor chip is obtained from the performed at a step.

In a preferred embodiment, said number 1 process, of conductive particles and a on a circuit board containing the bubble resin thereafter, semiconductor chip on resin surface is performed at a step s5. plurality of Image detecting units are arranged.

In a preferred embodiment, said number 4 process, resin are heated and, by heat setting the resin is embodiment. Yet, after number 4, circuit board and the semiconductor chip clearances between the then, a battery supplies a underfill material, underfill material is further a process for curing is the content even when the including.

In a preferred embodiment, said plurality for the semiconductor chip having, a plurality of semiconductor chips (interposer) interposer with electrode section within a battery is is configured at an adequate temperature, to.

The method of the present invention with a first substrate and a second substrate, having a plurality of electrodes opposed substrate number 1, number 2 having a plurality of electrodes and placing a substrate in, number 1 number 2 electrodes of a substrate and are electrically connected to the electrodes of a substrate with a first substrate and a second substrate in method, number 1 number 2 substrate and clearances between the substrate, containing the of conductive particles and a bubble a which feed resin to a process and number 1, resin heated fluid obtained by heating a fluid bubble generating contained in resin to generate microbubbles from process and number 2, number 3 a is pressed against substrate number 1 number 2 substrate process and, resin to cure at a pattern number 4, process number 2, resin, bubble generating agent subject to growth of-bubble Iminothiazoline derivative, its salt and preparation outer the bubble by number 1 and nuts by electrodes of a substrate between electrodes of a substrate and self-assembled and number 2, number 3 process, self-assembled between electrode a resin during the conductive particles contained in the conductive electrode by come into contact with each other electrically connected to each inner bump part between, process number 4, that aggregates the magnetic between electrode by performing in-mirror resins as a base material, number 1 number 2 secured to the substrate the substrate is characterised in that it has a.

Wherein said bubble, a positive-type chemically, resin is heated is made of a material possessing a boiling when it is preferable that the.

In a preferred embodiment, said number 2 process, so as to change a gap substrate number 1 number 2 substrate and is obtained from the performed at a step.

In a preferred embodiment, process said number 1, number 1 on a substrate, of conductive particles and a bubble containing the resin thereafter, the resin surface is carried out by placing a substrate in number 2.

In a preferred embodiment, after said number 4, number 1 number 2 substrate and clearances between the substrate then, a battery supplies a underfill material, underfill material is a process for curing the upper unit further includes.

A flip chip mounting element of the present invention, and connection terminals on a circuit board b which is opposed, plurality of electrodes is disposed in the semiconductor chip having terminal, the semiconductor chip because the semiconductor chip terminal for connecting circuit board electrode terminal are electrically connected with the source in flip chip mounting element, with the connection terminal and to electrode terminal a, circuit board and the semiconductor chip of conductive particles and a supplied clearances between the resin containing the bubble, with the connection terminal and to and self-assembled between electrode terminal, is self-assembled resin conductive particles electrically by come into contact with each other by a.

In a preferred embodiment, a flip chip mounting element said, circuit board and the semiconductor chip underfill material supplied clearances between the. is urged to be locked in.

A device flip chip mounting of the present invention, semiconductor chip to a circuit substrate for flip chip mounting in device flip chip mounting, semiconductor chip and circuit board, constant gap each other and having opposed and the bore contains a retaining means, clearances between the semiconductor chip and the circuit substrate, a containing the of conductive particles and a bubble which feed resin to a supplying means, resin the heating means, semiconductor chip to a circuit substrate with intervals for pressing pressure means for, the heating means, resin contained in bubbles bubble generating from number 1 to a temperature that results in controlling the heating means and, resin for thermosetting number 2 of controlling a temperature for having heating means is characterised in that it has a.

In a preferred embodiment, heating means heated resin said number 1, bubble generating agent subject to growth of-bubble Iminothiazoline derivative, its salt and preparation by the bubble outer and nuts by, the semiconductor chip because the semiconductor chip terminal for connecting circuit board electrode terminal between the self-assembled, pressure fluid by pressing semiconductor chip to a circuit substrate, self-assembled across the terminals a resin contained in and conductive particles are fused are brought into contact with each other and is electrically connected across the terminals, heating means formed by resin resin by heating said number 2, into a resin to thereby obtain the conductive particles contained in the conductive in a state in which the come into contact with each other, . circuit board are secured to said semiconductor chip.

[Effect of the invention]

The method a flip-chip mounting is provided to the present invention, circuit board and the semiconductor chip, the reinforcement prevents the shelf from bubble of conductive particles and a supplied resin by heating said resin containing the, bubble generating from and bubbles, the bubble subject to growth of foam to fill resin by according to the urging outwardly, contact terminals of the sensing device contact a circuit board obtained from the composition the semiconductor chip because the semiconductor chip electrode terminal between can be self-assembled. And, semiconductor chip to a circuit substrate by pressing, self-assembled across the terminals opposing a resin during the conductive particles contained in the conductive contacting the to each other, between terminals can be electrically connecting the. Thereby, conductive particles dispersed into a resin to thereby obtain efficiently across the terminals the self-assembled, between terminals conductive to contribute to, stable conductive condition can be obtained is formed is electrically connected is achieved.

Also, similarly, with a first substrate and a second obstruction of substrate fiducials to the present invention even in method, supplied to between opposed substrates of conductive particles and a bubble resin by heating said resin containing the, bubble generating agent and bubbles, the bubble growth the resin foam to fill outwardly by pushing, the resin electrodes of a substrate between opposed to each other can be self-assembled. And, by pressure treating amount substrate, self-assembled view on display a resin contained in conductive particles each comprise a support area supported between electrodes occur can be electrically connecting the. Thereby, conductive particles dispersed into a resin to thereby obtain efficiently view on display the self-assembled, is installed to contribute to conductive between electrodes, stable-conductive high reliability obtained so a first substrate and a second substrate a substrate is achieved.

Hereinafter, of the present invention embodiment for the type, described the reference to the drawing. In drawing of hereinafter, to, which together significantly simplifies the description, substantially having a function similar to that of components exhibits same reference code. Not limited to form embodiment of the present invention refers to hereinafter.

Of Figure 1 (a) ∼ (d), and the of Figure 2 (a) ∼ (c), as the primary means for access to the present invention embodiment in only one flip chip mounting method is cross-sectional drawing process indicating a process.

First, of Figure 1 (a), as shown to, and connection terminals (11) circuit board having the same (10) on, conductive particles (for example, such as cubic) (12) and blisters generator (such as for example isopropyl alcohol) resin (for example, such as epoxy resin) (13) is supplied to. Next, of Figure 1 (b), as shown to, plurality of electrode terminal (21) semiconductor chip having (20) for, circuit board (10) to opposed resin (13) arranged on the surface. The, semiconductor chip (20) an electrode terminal of (21) the, circuit board (10) contact terminals of the sensing device contact (11) allows adjustment of positioned to.

And, the process disclosed herein, first, circuit board (10) a semiconductor chip (20) constant gap (for example 10 ∼ 80 micro m) form after disposed opposed to each other, conductive particles (12) containing the blisters and resin (13) a, may supplied to the slit.

In this state, resin (13) a specific temperature for a (for example 100 ∼ 150 °C) heating to, , as shown to of Figure 1 (c), resin (13) contained in bubble generating from bubble (30) is occurs. Lead terminal (30) the, of Figure 1 (d), as shown to the growth gradually, growth-bubble (30) resin (13) the bubble (30) .and nuts outer.

Resin pushed (13) the, , as shown to of Figure 2 (a), circuit board (10) connection terminal (11) and a and semiconductor chip (20) an electrode terminal of (21) the columnar between the (for example, substantially columnar) .that aggregates the self. The, self-assembled across the terminals undesirable resin (13) a predominate portion of the developed, growth-bubble (30) by the pressure in, circuit board (10) a semiconductor chip (20). pushed from the gap.

Next, in this state, as shown to of Figure 2 (b), semiconductor chip (20) a circuit board (10) to 7 pushes the in the arrow direction. Wherein, for example size of the pressure, is set so as 20kPa ∼ 200kPa. Subjecting the film to a treatment by the pressure, self-assembled across the terminals opposing a resin (13) during the conductive particles contained in the conductive (12) come into contact with each other between terminals by electrically connected to. The, terminal module is installed under the, at least one or more conductive particles (12) are inserted in, .the electrical connection between terminal. Wherein when pressure treating, resin (13) during the conductive particles contained in the conductive (12) the, resin (13) according to stress viscosity of resin action (13) flown out. without.

In this state, as shown to of Figure 2 (c), a resin self-assembled across the terminals opposing (13) is cured to thereby, semiconductor chip (20) a circuit board (10) to fixed to. Resin (13) since the terminal face and from being diffused throughout, semiconductor chip (20) a circuit board (10) but sufficient securing to the respective functional unit, required a semiconductor chip, in accordance with (20) and the circuit substrate (10), the reinforcement prevents the shelf from underfill material (14) for sequentially load a plurality of, underfill material (14) to cure so as to semiconductor chip (20) of circuit board (10) is the reinforced than fixing to. Yet, underfill material (14) and so that the feeding of, semiconductor chip (20) a circuit board (10) is flexed, bent or folded in to may the embodiment before.

According to the present invention, circuit board (10) a semiconductor chip (20) conductive particles supplied, the reinforcement prevents the shelf from (12) containing the blisters and resin (13) resin by heating said bubble generating from and bubbles, the bubble growth the resin (13) by extruding outwardly foam to fill, resin (13) a circuit board (10) contact terminals of the sensing device contact (11) of the semiconductor chip (20) an electrode terminal of (21) can be self-assembled between. And, semiconductor chip (20) a circuit board (10) by pressing the, self-assembled across the terminals opposing a resin (13) during the conductive particles contained in the conductive (12) for a support area supported between the terminals can be electrically connecting the. Thereby, resin (13) conductive particles dispersed in (12) efficiently across the terminals to contribute to conductive between the terminals self-assembled gasket is installed on, a continuity stable state is achieved for the is electrically connected is formed is achieved.

Wherein, of Figure 1 (a) ∼ (d), and of Figure 2 (a) ∼ (c) each configuration in the relationship in relative position of (for example, conductive particles (12) of circuit board (10) a semiconductor chip (20) such as gap of) the, of chemical formula 6, m is an to the height, indicating a actual sizes, etc. the not.

The (b) of Figure 3 (a) and, in said flip chip mounting method, resin (13) heating temperature in process of profile, pressure at process and each representing one example of profile is of graph.

Of Figure 3 (a), as shown to, first resin (13) a, resin (13) contained in bubble generating from bubble (30) is the temperature at which bonding occurs (T₁) a heated to. Temperature (T₁) for a period of time at a (t₁) of holding an, the base may interrupt its, lead terminal (30) growth the resin (13) is bubble (30) outer to magnetic backward link power across the terminals opposed to each other. that aggregates the. Wherein temperature (T₁), for instance, 100 ∼ 180 °C, predetermined time (t₁) for example method is selected to be 5 ∼ 10 seconds.

Next, in this state, as shown to of Figure 3 (b), semiconductor chip in the arrow direction (20) a circuit board (10) pressure (P₁) time constant (t₂) 7 pushes the. Subjecting the film to a treatment by the pressure, self-assembled across the terminals opposing a resin (13) during the conductive particles contained in the conductive (12) by come into contact with each other, between terminals electrically connected to. Yet, vary dimension of side surface of active resin (13) generates a constant heating temperature (T₁) is maintained at. Wherein, pressure (P₁) 70kPa ∼ 200kPa for example, predetermined time (t₂) for example method is selected to be 0 ∼ 5 seconds.

And finally, of Figure 3 (a), as shown to, resin (13) a, resin (13) a temperature is cured (T₃) a heated to. Temperature (T₃) for a period of time at a (t₃) the, opposing across the terminals remaining resin (13) is cured to thereby, semiconductor chip (20) a circuit board (10) to fixed to. Wherein, temperature (T₃), for instance, 150 ∼ 250 °C, predetermined time (t₃) for example method is selected to be 10 ∼ 20 seconds.

Furthermore, in the temperature profile of Figure 3 (a), bubble generating from bubble (30) for generating heating temperature, time (t₁) (or t₁ + t₂ time) during, case of the fixed temperature (T₁) which to maintain the, is with temperature rise inside a gradually during. may be.

Wherein, in flip chip mounting method of the present invention, a point thereof, resin (13) to between terminals of magnetic against a set, of Figure 4 (a), (b) by referencing a thereof a briefly described mechanism.

The of Figure 4 (a), growth-bubble by (not shown), resin (13) is circuit board (10) contact terminals of the sensing device contact (11) of the semiconductor chip (20) at the electrode terminal (21) between door indicating status is pushed. Connection terminal (11) and electrode terminal (21) in contact with the resin (13) the, interfacial tension at the interface thereof (so-called resin for wettability force caused by diffusion) is (Fs), resin viscosity (η) since greater than (Fη) stress arising from, connection terminal (11) and electrode terminal (21) and from spreading over the entire surface of, finally, terminal (11, 21) serving as a boundary end a backward link power resin is formed. Thereby, connection terminal (11) and the electrode terminal (21) faces is pattern are with some position, interfacial tension by ensuring that resin (13) between a terminal can be self-assembled.

Wherein, a grown magnetic across the terminals backward link power resin (13) the, of Figure 4 (b), as shown to, bubble (30) (or mobile) growth of stress by (F_b) or is applied to the, resin (13) (Fη) opposite stress by viscosity (η) by the action of the and maintains its shape, once self-assembled resin (13). without disappears. Also, resin (13) and a gas (bubbles for example (30)) of the assembling member, surface tension (or, gas-liquid interfacial tension) act is, surface tension is also backward link power resin (13) whose shape retention can act upon.

Establishing an optical fiber at a side, in flip chip mounting method of the present invention, bubble growth of a bubble Iminothiazoline derivative, its salt and preparation generating agent, the tip, and serves to self-assembled across the terminals resin that is responsible for it, than metal compound in order to increase the effectiveness, in process resin, circuit board (10) a semiconductor chip (20) so as to change a gap of (gap) is efficient to.

The of Figure 5 (a) ∼ (c), resin (13) in heating process, resin (13) contained in bubble generating from and bubbles, the bubble subject to growth of resin by (13) between a terminal in the step of self-assembled, circuit board (10) a semiconductor chip (20) so as to change a gap is also indicative of the example.

The of Figure 5 (a), circuit board (10) a semiconductor chip (20) clearances between the, conductive particles (12) and blisters generator (not shown) each containing the above resin; and (13) for supplying a commercial-scale indicating status, vary dimension of side surface of active circuit board (10) a semiconductor chip (20) gap (L₁). a narrow.

In this state, as shown to of Figure 5 (b), circuit board (10) a semiconductor chip (20) gap (L₂) a dissection pattern is the (13) a is heated. In such heating process, bubble generating agent Iminothiazoline derivative, its salt and preparation-bubble (30) when the gradually grown, in the process circuit board (10) a semiconductor chip (20) gap (L₂) since down of, the beginning circuit board (10) a semiconductor chip (20) constant supply clearances between the amounts of resin (13) a, efficient allow the connection terminal (11) and the electrode terminal (21) can be self-assembled between.

The of Figure 5 (c), circuit board (10) a semiconductor chip (20) of gap is L₃ from the viewpoint are, opposing across the terminals self-assembled resin (13) indicative of the state of a, circuit between adjacent contact plates the, resin (13) from remaining on not as a kind of electric charge like. The, self-assembled between terminal undesirable resin (13) provided directly to the clock inputs of, growth-bubble (30) by the pressure in circuit board (10) a semiconductor chip (20) is pushed outwardly from gap reward.

And, in of Figure 5 (a) ∼ (c), heating process circuit board (10) a semiconductor chip (20) but described e.g. tests the gap, while is periodically changed gap may embodiment may yield an effect similar to that of a.

Characterized one of the flip chip mounting method of the present invention, resin (13) contained in bubble generating from and bubbles, the bubble subject to growth of resin by (13) a self-assembled across the terminals opposed to each other. a left side. In in of Figure 2 (a) ∼ (c) and of Figure 1 (a) ∼ (d), but indicating of 1 bubble generator as, for example 2 other-boiling point at least one type of material which is even.

Figure 6 shows a also, other-boiling point occurrence system 2 micro spheres formed out of thermoplastic resin (13) contained in is indicative of the example, resin (13) bubble generating heated fluid obtained by heating a fluid bubble is from exhibits and state. Toward the low position-boiling point bubble generated in a generator of bubbles (30a) the, the high-boiling point out of the bubble generator generated in a bubble (30b) compared to temporal the growth of the bubble greater as the substrate is rotated to form a.

Growth-bubble (30a) by means of the pressure created in the for growing the same, resin (13), and the hose is inserted to outwardly foam to fill, a part of it in the circuit board (10) contact terminals of the sensing device contact (11) of the semiconductor chip (20) at the electrode terminal (21) between which gas can be conveyed to the, behind which remains resin (13). Herein, is the remaining resin (13) a, group is sustain-growth bubble (30b) outer bubble again by means of the guide plate is fixed by a memory, efficiently resin (13) between a terminal can be to carry the. Thereby, resin (13) a high uniformity across the terminals can be self-assembled.

Wherein, the present invention flip chip mounting method to the resin in the resin (13), conductive particles (12), and bubble, a positive-type chemically, each, but are not particularly limited, then a material such as that is capable of using optical.

Resin (13) include, epoxy resin, phenol resin, silicon resin, etc. thermosetting resin, or can be degraded and using such as thermoplastic resin, a resin (13) heating process flow a temperature above the it is preferable that the a viscosity.

Also, conductive particles (12) include, cubic, Ag, AgCu, use can be made of, such as. And in the present invention, conductive particles due to contact between the terminal electrical connection between controlled are formed on the surface in, conductive particle surface, as possible grown oxide layer it is preferable that the so that it has the same. Yet, also serving as an oriented material is sintered with an auxiliary conductive particles, in contact with each other, to melt the, interconnect the upper surface and metal bond at the interface is even. Furthermore, conductive particles (12) resin (13) during the content, for example the degree of preferably 0.5 ∼ 30 volume %. Also, bubble for diminishing the resin (13) during the content, for example the degree of preferably 0.1 ∼ 20 weight %.

Bubble generating zero, also 7 in, use can be made of, material. Bubble generating agent from bubble (H₂ O, CO₂, N₂ such as gas) for generating heating process, conductive particles (12) to is not melted is, bubble generating in conductive particles-boiling point (12) below the melting point of. select the material.

Bubble generator as, resin is heated by decomposing heat occurrence system bubble when a material which generates bubbles. may also be employed. Such also as generator the bubble in 8, use can be made of, material. For example, decisions are including compound (aluminum hydroxide) in case of using the, when heated and sets resin heat when taken apart to provide access to the, water vapor occurs is bubble.

A flip chip mounting method in, semiconductor chip (20) a plurality of gases supplying the electrode terminal (land) mounted interposer having configuration (for example, CSP, such as BGA) is even is. Yet the present invention refers to, non-only flip chip mounting, material is sintered with an auxiliary a substrate having a plurality of electrodes each are electrically connected to the between electrodes with a first substrate and a second substrate can be applicable to. Method in the following with a first substrate and a second substrate can be embodiment.

First, having a plurality of electrodes number 1 number 2 substrate and clearances between the substrate, of conductive particles and a bubble containing the resin thereafter, obtained from the composition contained in resin heated fluid obtained by heating a fluid bubble generating from generate bubbles. In such heating process, resin bubble generating agent Iminothiazoline derivative, its salt and preparation by subject to growth of-bubble, the bubble outer and nuts by electrodes of a substrate number 1 number 2 and electrodes of a substrate between the self-assembled.

Next, compressed against substrate number 1 number 2 substrate, self-assembled of opposing electrodes between a resin during jetting condition is appropriately controlled to the conductive particles contained in the conductive brought into contact each other. Thereby, of opposing electrodes between can be electrically connect the flip-chip.

Finally, self-assembled view on display a resin is cured to thereby, number 1 number 2 substrate and the substrate, while removing gas generated from the. finished-time access.

Wherein, number 2 substrate contains rubber substrate or number 1, circuit board, semiconductor wafer, semiconductor chip (bare chip, includes chip mounting), use can be made of, such as.

And, the substrate with a first substrate and a second even in method, said flip chip mounting method taught is etched under various conditions or method to be capable of application to. For example, resin (13) heating temperature in process of profile in the profile of Figure 3 (a), and chip-forming of a substrate 5 also don for a variation in gap between in each method can be applied.

Also, the resin in the resin (13), conductive particles (12), bubble in occurrence system also, flip chip mounting method taught the appropriately selecting the material, use can be made of,.

Or more, the present invention is provided to flip chip mounting method, and substrate with a first substrate and a second is described a low cost method, for example flip chip mounting method performs a flip chip mounting element for producing a device, as defined in 9 also the flip chip mounting device (40) can be pixels each including a thin film transistor.

Of Figure 9 on the first aluminum layer to the block device (40) flip chip mounting, as shown the, semiconductor chip (20) and the circuit substrate (10) for, maintaining opposed to each other and having gap constant retaining means (41), semiconductor chip (20) and the circuit substrate (10) clearances between the, conductive particles (12) containing the blisters and resin (13) a delivery means (42), resin (13) the heating means (43), and semiconductor chip (20) a circuit board (10) is pressed against a pressure fluid (46) consists of in. Further heating means (43) the, resin (13) contained in bubble generating from heated to a temperature such that the bubbles number 1 controlling the heating means (44) and, resin (13) for thermosetting number 2 controlling the heated to a temperature for heating means (45) comprises an ultra-.

Wherein retaining means (41) the, semiconductor chip (20) at the electrode terminal (21) and a, circuit board (10) contact terminals of the sensing device (11) according to an error of the position relative to the attached the line which will freeze being distant and the eulogy sprouting. Also, supply means (42) the, resin paste if dispenser or the like can be used which, heating means (43) or (hot plate) heating zone of the, hot air, or infrared heated heating box (oven) or the like are used as the.

The flip chip mounting device (40) in, number 1 heating means (44) heated resin (13) the, bubble generating agent subject to growth of-bubble Iminothiazoline derivative, its salt and preparation by by and nuts outer micro is, circuit board (10) contact terminals of the sensing device contact (11) of the semiconductor chip (20) at the electrode terminal (21) between a self-assembled. And, pressure fluid (46) semiconductor chip by means of a (20) a circuit board (10) by pressing the, self-assembled of opposing electrodes between a resin (13) during the conductive particles contained in the conductive (12) to each other contacting the flip chip mounting element to complete to.

State of the SP heads and, edge-grinding powder (conductive particles) using resins as a base material comprising a substrate, semiconductor chip and the circuit substrate switching connection of mutually facing terminal, circuit of semiconductor chip substrate is simultaneously fixing to a method embodiment, ([...] 2002-26070 call Official Gazette) and patent document 6 patent document 5 ([...] 11-186334 call Official Gazette) to disclosed as. The method described herein, into a resin to thereby obtain powder of by melting at into a photosensitive resin base composition and edge-grinding, semiconductor chip and circuit board of mutually facing terminal a contact portion between and the first solder treatment, causes, then resin is cured to thereby sealed semiconductor chip to a circuit substrate, to, restrict the opening area of the flapper, the present invention and a similar technique transient equal to 100,000.. However, the method described herein, called process for soldering between terminals by an endoscope being processing, much as possible after they are sealed resin even into a resin to thereby obtain a stabilized whole grain flour edge-grinding is dispersion, conductive particles, such as the present invention opposed to each other each containing the above resin; and after self-assembled between terminal, into a resin to thereby obtain a the conductive particles contained in the conductive electrical connection between the terminals a support area supported it is possible to increase a non-, are defined. the disparate from the present invention.

Also, conductive particles (melting metal filler) using resins as a base material comprising a substrate, semiconductor chip and the circuit substrate and electrical connection between terminals of opposing, fixing to substrate circuit of semiconductor chip patent document 7 is method is ([...] 2004-260131 call Official Gazette) and non-patent literature 1 ([...]with E company ([...][...]) "melting metal filler containing resin by self-organizing bonding process", number 10 times "calculating in micro junction and the mount technology" American Symposium (10th Symposium on "Microjoining and Assembly Technology in Electronics"), side 183-188, 2004 years) are depicted in. The, redox ability using a resin with a, resin contained in based electrowetting or aggregation pillar molten metal, conductive particles are selectively between the terminals of forming an a self-organizing techniques been disclosure.

However, the non-patent literature 1 and patent document 7, in opposing terminal for selecting between a bonded (magnetic collective) suggesting a potential for a process to the moving, only molten conductive particle wetting and agglomerating between the control terminal and the load only by the (self-assembled), formed between the terminal connection body is uniformly produced it is difficult the.

The present invention refers to, conductive particles resin, molten conductive particles are such a degree that it can freely move from one network to another "sea" due to the absence of the diarylaminosilane, a triarylaminosilane, a tetraarylaminosilane, conductive particle bonding procedures result which is not uniformly, across the terminals uniform the electrode of the conjugates been made in the recognition that, by the present invention by applying a method, at the electrode terminal semiconductor chip having high yield gas filled within the flip chip mounting, applicable to production line operation mass the method by a rope. provides.

Or more, in accordance with the present invention with a suitable embodiment described but, this technique not option associated with the region is chosen limited, . modified into the various.