SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

26-12-2013 дата публикации

Номер:

US20130341785A1

Автор: Lei Fu, Lihong Cao, Xuefeng Zhang

Принадлежит: Advanced Micro Devices Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/03 H01L2224/034 H01L2224/0341 H01L2224/03416 H01L2224/0347 H01L2224/035 H01L2224/0351 H01L2224/03515 H01L2224/036 H01L2224/0361 H01L2224/03614 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/050 H01L2224/0500 H01L2224/05005 H01L2224/0502 H01L2224/05026 H01L2224/0507 H01L2224/05073 H01L2224/051 H01L2224/0512 H01L2224/05124 H01L2224/0514 H01L2224/05144 H01L2224/05147 H01L2224/0515 H01L2224/05155 H01L2224/0516 H01L2224/05166 H01L2224/055 H01L2224/0554 H01L2224/05541 H01L2224/0555 H01L2224/05552 H01L2224/05555 H01L2224/0556 H01L2224/05562 H01L2224/05567 H01L2224/0557 H01L2224/05572 H01L2224/0558 H01L2224/05583 H01L2224/05584 H01L2224/056 H01L2224/0564 H01L2224/05644 H01L2224/05647 H01L2224/1 H01L2224/11 H01L2224/113 H01L2224/1132 H01L2224/114 H01L2224/1146 H01L2224/1147 H01L2224/118 H01L2224/1184 H01L2224/11849 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13005 H01L2224/13007 H01L2224/1302 H01L2224/13022 H01L2224/131 H01L2224/1311 H01L2224/13111 H01L2224/13116 H01L2224/1313 H01L2224/13139 H01L2224/1314 H01L2224/13144 H01L2224/13147 H01L2224/1316 H01L2224/13164 H01L2224/13169 H01L2224/16 H01L2224/165 H01L2224/1650 H01L2224/16506 H01L23 H01L23/H01L23/2 H01L23/29 H01L23/293 H01L23/3 H01L23/31 H01L23/319 H01L23/3192 H01L24 H01L24/H01L24/0 H01L24/03 H01L24/05 H01L24/1 H01L24/11 H01L24/13 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/01 H01L2924/013 H01L2924/0132 H01L2924/01322 H01L2924/1 H01L2924/12 H01L2924/120 H01L2924/1204 H01L2924/12042

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/2 H01L23/29 H01L23/293 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/8 H01L24/81

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