Bump structures for multi-chip packaging

13-09-2016 дата публикации

Номер:

US9443814B2

Автор: Chen-Hua Yu, Jing-Cheng Lin

Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/1 H01L2224/13 H01L2224/130 H01L2224/1308 H01L2224/13083 H01L2224/131 H01L2224/1311 H01L2224/13111 H01L2224/13113 H01L2224/13116 H01L2224/1312 H01L2224/13124 H01L2224/1313 H01L2224/13139 H01L2224/1314 H01L2224/13144 H01L2224/13147 H01L2224/1315 H01L2224/13155 H01L2224/1316 H01L2224/13166 H01L2224/1318 H01L2224/13181 H01L2224/135 H01L2224/1356 H01L2224/13564 H01L2224/14 H01L2224/141 H01L2224/1412 H01L2224/1417 H01L2224/14177 H01L2224/1418 H01L2224/14181 H01L2224/145 H01L2224/1450 H01L2224/14505 H01L2224/16 H01L2224/161 H01L2224/1610 H01L2224/16106 H01L2224/1614 H01L2224/16145 H01L2224/162 H01L2224/1623 H01L2224/16238 H01L2224/17 H01L2224/171 H01L2224/1710 H01L2224/17107 H01L2224/8 H01L2224/81 H01L2224/811 H01L2224/8119 H01L2224/81193 H01L2224/818 H01L2224/8181 H01L2224/81815 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/488 H01L23/49 H01L23/498 H01L23/4981 H01L23/49811 H01L23/49816 H01L23/4982 H01L23/49827 H01L23/4983 H01L23/49838 H01L24 H01L24/H01L24/1 H01L24/13 H01L24/14 H01L24/16 H01L24/17 H01L24/8 H01L24/81 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0655 H01L25/1 H01L25/18 H01L25/5 H01L25/50 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/01 H01L2924/010 H01L2924/0102 H01L2924/01028 H01L2924/01029 H01L2924/04 H01L2924/049 H01L2924/0494 H01L2924/04941 H01L2924/0495 H01L2924/04953 H01L2924/3 H01L2924/38 H01L2924/381

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/498 H01L23/4982 H01L23/49827 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L25/5 H01L25/50

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