Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element

17-12-2013 дата публикации

Номер:

US8609444B2

Автор: WADA SATOSHI, MORIYAMA MIKI, GOSHONOO KOICHI

Принадлежит: WADA SATOSHI, MORIYAMA MIKI, GOSHONOO KOICHI, TOYODA GOSEI KK, TOYODA GOSEI CO., LTD.

Контакты:

Номер заявки: 10-73-6590

Дата заявки: 24-02-2010

A manufacturing method of a mounting part of a semiconductor light emitting element comprising: preparing a semiconductor light emitting element including an electrode which has a surface, and a board which has a surface; forming a plurality of bump material bodies on at least one of the surface of the electrode and the surface of the board by shaping bump material into islands, wherein the bump material is paste in which metal particles are dispersed, a top surface and a bottom surface of the bump material bodies have different areas, and the top surface is practically flat; solidifying the bump material bodies by thermally processing the bump material bodies; and fixing the semiconductor light emitting element and the board through the bumps.

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/1 H01L2224/11 H01L2224/113 H01L2224/1131 H01L2224/1132 H01L2224/115 H01L2224/1150 H01L2224/11505 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13005 H01L2224/1301 H01L2224/13013 H01L2224/13014 H01L2224/13017 H01L2224/13019 H01L2224/131 H01L2224/1313 H01L2224/13139 H01L2224/1314 H01L2224/13144 H01L2224/1316 H01L2224/13164 H01L2224/13169 H01L2224/132 H01L2224/1329 H01L2224/13294 H01L2224/133 H01L2224/1333 H01L2224/13339 H01L2224/1334 H01L2224/13344 H01L2224/1336 H01L2224/13364 H01L2224/13369 H01L2224/14 H01L2224/141 H01L2224/1415 H01L2224/14154 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L2224/16227 H01L2224/2 H01L2224/27 H01L2224/273 H01L2224/2732 H01L2224/275 H01L2224/2750 H01L2224/27505 H01L2224/29 H01L2224/290 H01L2224/2901 H01L2224/29013 H01L2224/291 H01L2224/2913 H01L2224/29139 H01L2224/2914 H01L2224/29144 H01L2224/2916 H01L2224/29164 H01L2224/29169 H01L2224/292 H01L2224/2929 H01L2224/29294 H01L2224/293 H01L2224/2933 H01L2224/29339 H01L2224/2934 H01L2224/29344 H01L2224/2936 H01L2224/29364 H01L2224/29369 H01L2224/3 H01L2224/30 H01L2224/301 H01L2224/3015 H01L2224/30154 H01L2224/32 H01L2224/320 H01L2224/3201 H01L2224/3205 H01L2224/32057 H01L2224/7 H01L2224/73 H01L2224/731 H01L2224/7310 H01L2224/73103 H01L2224/732 H01L2224/7320 H01L2224/73203 H01L2224/8 H01L2224/81 H01L2224/811 H01L2224/8119 H01L2224/81191 H01L2224/812 H01L2224/8120 H01L2224/81203 H01L2224/83 H01L24 H01L24/H01L24/1 H01L24/11 H01L24/13 H01L24/2 H01L24/29 H01L24/3 H01L24/30 H01L24/32 H01L24/8 H01L24/81 H01L24/83 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00011 H01L2924/00013 H01L2924/00014 H01L2924/01 H01L2924/010 H01L2924/0100 H01L2924/01004 H01L2924/01005 H01L2924/01006 H01L2924/0101 H01L2924/01012 H01L2924/01015 H01L2924/0102 H01L2924/01027 H01L2924/0103 H01L2924/01033 H01L2924/01038 H01L2924/0104 H01L2924/01046 H01L2924/01047 H01L2924/0105 H01L2924/01051 H01L2924/01052 H01L2924/01056 H01L2924/0107 H01L2924/01074 H01L2924/01078 H01L2924/01079 H01L293 H01L2933 H01L2933/H01L2933/0 H01L2933/00 H01L2933/006 H01L2933/0066 H01L3 H01L33 H01L33/H01L33/6 H01L33/62 H1 H10 H10H H10H2 H10H20 H10H20/H10H20/0 H10H20/03 H10H20/036 H10H20/0364 H10H20/8 H10H20/85 H10H20/857

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/0 H01L21/00

Цитирование НПИ

Japanese Office Action dated Dec. 18, 2012 and English Translation Thereof.

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