半导体器件封装和制造其的方法

13-05-2022 дата публикации

Номер:

CN114496968

Автор: 丁秀真, 吴在浚, 朴永焕, 金钟燮, 黄瑄珪

Принадлежит: SAMSUNG ELECTRONICS CO LTD

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/561 H01L21/568 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0402 H01L2224/04026 H01L2224/06 H01L2224/060 H01L2224/0603 H01L2224/1 H01L2224/11 H01L2224/111 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13008 H01L2224/16 H01L2224/162 H01L2224/1624 H01L2224/16245 H01L2224/2 H01L2224/29 H01L2224/290 H01L2224/2901 H01L2224/29013 H01L2224/3 H01L2224/30 H01L2224/300 H01L2224/3003 H01L2224/301 H01L2224/3012 H01L2224/32 H01L2224/322 H01L2224/3224 H01L2224/32245 H01L2224/8 H01L2224/81 H01L2224/810 H01L2224/8100 H01L2224/81009 H01L2224/83 H01L2224/830 H01L2224/8300 H01L2224/83005 H01L2224/834 H01L2224/8344 H01L2224/83447 H01L2224/838 H01L2224/8380 H01L2224/83801 H01L2224/8389 H01L2224/83895 H01L2224/9 H01L2224/94 H01L23 H01L23/H01L23/1 H01L23/13 H01L23/14 H01L23/2 H01L23/29 H01L23/293 H01L23/3 H01L23/31 H01L23/310 H01L23/3107 H01L23/311 H01L23/3114 H01L23/36 H01L23/367 H01L23/4 H01L23/49 H01L23/495 H01L23/4951 H01L23/4954 H01L23/49544 H01L23/49548 H01L23/4956 H01L23/49562 H01L23/4958 H01L23/49582 H01L23/498 H01L23/4981 H01L23/49816 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/06 H01L24/09 H01L24/1 H01L24/11 H01L24/13 H01L24/16 H01L24/3 H01L24/32 H01L24/33 H01L24/8 H01L24/81 H01L24/83 H01L24/9 H01L24/94 H01L29 H01L29/H01L29/2 H01L29/20 H01L29/200 H01L29/2003 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/18 H01L2924/181 H01L2924/1816 H01L2924/18161

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/1 H01L23/13 H01L24 H01L24/H01L24/8 H01L24/81 H01L24/83

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