ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
29-08-2013 дата публикации
Номер:
WO2013125086A1
Принадлежит: 日立化成株式会社
Контакты:
Номер заявки: JP54-07-201212
Дата заявки: 01-10-2012
Provided is an adhesive for a semiconductor that contains an epoxy resin, a curing agent, and a compound having the group represented by formula (1). [In the formula, R1 indicates an electron-donating group.][0000][1]